ThermalWorks

Thermally Managed ( up to 1000 W /m K thermal transfer rate ), CTE controlled, Very Rigid, Light Weight STABLCOR PCB / Substrate Technology

Manufacturer

ThermalWorks� is a spin-off company from SDC Circuits, offering Engineering & Manufacturing Services focusing on Thermal Management of Laminate Materials and Resin Systems Development for Printed Circuit Boards ( PCBs ) ------------------------------------------------ SDC Circuits is an established 18 year old Special Projects, Quick-Turn, Prototype & Production Run Printed Circuit Board ( PCB ) contract manufacturer to the Electronics Industry, to U.S. Defense Department agencies and contractors. ------------------------------------------------ ThermalWorks� CAPABILITIES & EXPERTISE: ------------------------------------------------ STABLCOR Printed Circuit Board Thermal Management Design and Manufacture. ------------------------------------------------ Thermal Management Electronic Structures for Commercial & Aerospace Applications New Material Laminate & Resin System Design ( Thermally and Electrically Conductive Materials ) Flip Chip on Board Substrates Design Prototype Fabrication Prototype Testing. ------------------------------------------------ THERMAL CONDUCTIVITY BENEFITS USING STABLCOR ------------------------------------------------ (1)HIGH THERMAL CONDUCTIVITY WITH A PRODUCT FAMILY THAT RANGES FROM (100 W/m K) UP TO (1000 W/m K) ------------------------------------------------ CTE BENEFITS USING STABLCOR ------------------------------------------------ (1) ABLE TO MORE CLOSELY MATCH THE CTE MISMATCH THAT IS FOUND WITH SILICON SEMICONDUCTOR DEVICES WHEN USED WITH STANDARD FR-4 PCBs. (2) LONGER LIFE OF COMPONETS DUE TO LESS STRESS ON SOLDER JOINTS. (3) STABLCOR� MATERIAL HAS A NEGATIVE CTE OF -1.2 to -1.1 ppm AND IS TAILORABLE TO MORE CLOSELY MATCH CUSTOMERS REQUIREMENTS. ------------------------------------------------ THERMAL TRASNFER BENEFITS USING STABLCOR ------------------------------------------------ (1) STABLCOR� PCB CAN DIRECT A THERMAL PATH FROM COMPONENT TO BOARD TO FRAME (HEAT SINK). (2) ALLOWS FOR SMALLER SIZE HEAT SINKS AND FANS. (3) CAN TIE DIRECTLY INTO STABLCOR� LAYER WITH GROUND / POWER LEAD, THERMAL VIA COMBINATION FOR DIRECT THERMAL CONDUCTION PATH. ------------------------------------------------ STIFFNESS BENEFITS USING STABLCOR ------------------------------------------------ (1) 4X MORE STIFF THAN FR-4 / POLYIMIDE TECHNOLOGY (2) INCREASE YIELDS IN ASSEMBLY PROCESS (REDUCED BOWING) (3) HIGHER VIBRATION FREQUENCY THAN FR-4 / POLYIMIDE (4) PREVENTS WARPING (5) REDUCES THE NEED FOR MECHANICAL REINFORCEMENTS (REDUCES WEIGHT) ------------------------------------------------ VIBRATION BENEFITS USING STABLCOR ------------------------------------------------ (1) INCREASES VIBRATION FREQUENCY (2) WITHSTANDS MORE VIBRATION (3) REDUCES INFLEXTIONS (4) VIBRATION TESTS PERFORMED BY TRW SPACE & COMMUNNICATIONS

ThermalWorks Postings

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STABLCOR

STABLCOR� is a Thermally Managed PCB / Substrate material technology with many benefits: High Thermal Conductivity with a product family that ranges from 100 W/m K up to 1000 W/m K Can more closely match the CTE mismatch that is common today...

STABLCOR
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