AIM Solder

AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry.


AIM offers a full product line to the electronics industry that includes solder paste, liquid flux, wire solder, bar solder, plating anodes, adhesive, spheres, preforms, chemicals, and cleaners. AIM is ISO and QS9000 certified with manufacturing and distribution facilities in Canada, USA, Mexico, Europe, Asia, Australia, and South Africa.

AIM's product line includes a full range of solder products and a wide variety of lead-free solder alloys:

  • Lead-Free - lead-free alloys, solder pastes and cored wires.
  • No Clean - no-clean solder paste, liquid flux, wire solder, paste flux.
  • Water Soluble - water soluble solder paste, liquid flux, wire solder, paste flux.
  • Rosin Based - RMA & RA solder paste, liquid flux, wire solder, paste flux.
  • Chemicals & Cleaners - flux thinner, stencil cleaners, saponifiers.
  • Specialty Materials - Indium, gold and other specialty solders, preforms, fusible alloys, seals, compounds, target materials, test kit.
  • Bars & Anodes - bar solder, plating anodes.
  • Adhesives - surface mount adhesive, uUnderfill.
  • Miscellaneous - descaler, defoamer, deox powder, titration kit.
  • Alloys - common, specialty (high- and low-temperature), and lead-free alloys.

Global Manufacturing And Support

AIM is well-equipped to handle the growing need for quality solder products, support and service around the globe. With a manufacturing and support presence throughout the Americas, Europe, Asia and Australia, AIM's rapidly expanding family of customers is assured of a level of quality, consistency and dependability unsurpassed in the electronics industry.

AIM Solder Postings

44 products »

High Melting Point Solder Alloys

Down hole electronics, such as oil and gas exploration, require solder alloys that have the durability to withstand the extreme thermal, geological and mechanical stresses of these applications. AIM understands system reliability is of t...

Solder Materials

High Melting Point Solder Alloys

SN100C - Lead-Free Solder Alloy

Best choice for lead-free wave soldering. SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven...

Solder Materials

SN100C - Lead-Free Solder Alloy

SAC305 Lead-Free Solder Alloy

SAC305 is a lead-free alloy that contains 96.5 % tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as c...

Solder Materials

 SAC305 Lead-Free Solder Alloy

Sn63/Pb37 Electropure™ High Purity Solder Alloy

Sn63/Pb37 Electropure™ is a high purity alloy that is composed of 63% tin and 37% lead. Electropure is alloyed in a proprietary method that results in a low drossing, high wetting solder. The Electropure process reduces suspended o...

Solder Materials

Sn63/Pb37 Electropure™ High Purity Solder Alloy

DJAW-10 Stencil Cleaner

DJAW-10 is a long chained alcohol based stencil cleaner with a concentrated additive that is 100% compatible with all AIM solder pastes. DJAW-10 is formulated for application by hand or automated dispensing equipment. Unlike other stenci...

Cleaning Agents

DJAW-10 Stencil Cleaner

200AX Stencil Cleaner - Hand Application

A solvent blend stencil cleaner with a concentrated additive that is 100% compatible with all AIM solder pastes and epoxies. 200AX is formulated for application by hand. Where automatic application is desired, AIM’s DJAW Stencil Cleaner...

Cleaning Agents

200AX Stencil Cleaner  - Hand Application

AIMTERGE 6035 Solder Paste, Flux and Wire Residues Cleaner

AIMTERGE 6035 cleaner is a saponifier formulated to readily remove resin, rosin, no clean and water soluble flux residues from printed circuit boards, while preventing the attack of components and aluminum hardware common with many saponifers. The...

Cleaning Agents

AIMTERGE 6035 Solder Paste, Flux and Wire Residues Cleaner

Common Flux Thinner

Common Flux Thinner is a solvent that is used to thin Water Soluble, No Clean and RMA fluxes in foaming and some spray applications. Use of Common Flux Thinner is suggested when the flux acid number is too high due to solvent evaporation or residu...

Solder Materials

Common Flux Thinner

Underfill FF35

Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Und...


Underfill FF35

Surface Mount Epoxy 4089

Epoxy 4089 is a single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly. Epoxy 4089 has a formulated tolerance to shear-thinning, a dot formation suitable for automated dispense equ...


Surface Mount Epoxy 4089

See all products from AIM Solder »

14 technical articles »

AIM Tech Tip Article: Pretty Slick

Jun 20, 2022 | Timothy O'Ne i l l

We've been doing a lot of print testing in our lab. In our first set of published results, "The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance1" from IPC/APEX 2016, we revealed a hierarchy of input variables to maximize solder paste transfer efficiency and minimize variation. In that study, we used a fully-optioned stencil as part of the equipment set. In order to tease out the data we were looking for, we could not lose critical information to the noise of stencil-induced variations....

Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction

Sep 26, 2018 | Carlos Tafoya, Gustavo Ramirez, Timothy O’Neill

Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages....

A Study to Determine the Impact of Solder Powder Mesh Size and Stencil Technology Advancement on Deposition Volume when Printing Solder Paste

Apr 13, 2017 | Karl Seelig, Tim O'Neill

The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.

As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.

The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs....

Sample Preparation For Mitigating Tin Whiskers In Alternative Lead-Free Alloys

Feb 18, 2016 | Mehran Maalekian, Karl Seelig, Timothy O'Neill

As lead-free alloys shift into high reliability electronics, the issue of tin whisker growth remains a primary concern among those in the industry. Current research shows that there is no perfect alloy for all cases of electronic usage. Industry leaders and researchers continue to study and search for a lead free alloy that is able to withstand harsh environments while maintaining high reliability....

Conformal Coating over No Clean Flux Residues

Mar 04, 2015 | K.Seelig, T.O'Neill

As the proliferation of modern day electronics continues to drive miniaturization and functionality, electronic designers/assemblers face the issue of environmental exposure and uncommon applications never previously contemplated. This reality, coupled with the goal of reducing the environmental and health implications of the production and disposal of these devices, has forced manufacturers to reconsider the materials used in production. Furthermore, the need to increase package density and reduce costs has led to the rapid deployment of leadless packages such as QFN, POP, LGA, and Micro-BGA. In many cases, the manufacturers of these devices will recommend the use of no clean fluxes due to concerns over the ability to consistently remove flux residues from under and around these devices. These concerns, along with the need to implement a tin whisker mitigation strategy and/or increase environmental tolerance, have led to the conundrum of applying conformal coating over no clean residues....

Lead-Free Soldering Guide

May 12, 2014 | AIM

The issue of lead-free soldering has piqued a great deal of interest in the electronics assembly industry as of late. What was once an issue that seemed too far away to worry about has become a pressing reality. In order to avoid confusion, last minute panic, and a misunderstanding of how the issue of lead-free soldering will affect the industry and individuals users of solders, it is necessary for all suppliers and assemblers to become educated in this matter....

Head-in-Pillow BGA Defects

Nov 05, 2009 | Karl F. Seelig.

Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress....

The Call for Halogen-Free Electronic Assemblies

Jun 17, 2009 | Karl Seelig, Michael Burgess.

The increased interest in halogen-free assemblies is a result of Non-Government Organizations (NGOs) exerting pressure on electronic equipment manufacturers to eliminate halogens. The NGOs primary focus is on resolving global environmental issues and concerns. As a result of an increase in the enormous "e-waste" dump sites that have begun showing up around the world, NGOs are pushing consumer electronic manufacturers to ban halogen-containing material in order to produce "green" products. Not only are these sites enormous, but the recycling methods are archaic and sometimes even illegal.

This stockpiling and dumping has created growing political and environmental issues. In order to deal with this issue, the question of why halogens are a focal point must be addressed....

Controlling Copper Build Up in Automatic Soldering Equipment Using Lead-Free Solder

Nov 20, 2008 | Karl Seelig, David Suraski.

The Sn/Ag/Cu family of alloys is the leading candidate for a lead-free alternative. The first part of this study was to determine if there is any significant difference between Sn/Ag/Cu alloys when used in automatic soldering equipment in terms of copper build-up in the system. The study compared two Sn/Ag/Cu alloys to determine if at processing temperatures one alloy would absorb less copper than the other alloy....

Reflow Profiling: Time Above Liquidus

Dec 20, 2007 | David Suraski

Despite much research and discussion on the subject of reflow profiling, many questions and a good deal of confusion still exist. What is clear is that the pains often associated with profiling can be reduced if there is a strong understanding of the variables that can be encountered during the reflow process, as well as the metallurgical dynamics of the soldering process. This paper shall provide a brief outline of the reflow profile in general, with specific emphasis placed upon the suggested time spent above the melting temperature of the solder. The guidelines for soldering to various surfaces and with alternative solder alloys also are discussed....

4 more technical articles from AIM Solder »

47 news releases »

AIM Solder Expands Technical Support in Mexico

Jan 29, 2014 | AIM Solder announces the appointment of Andrés Rojas to the position of Technical Support Engineer. Based out of Monterrey, Mexico, Andrés will assist in finding technical solutions for AIM customers within the Northeastern regions of Mexico.

AIM Solder Announces Appointment of Can Li as Sales Manager of Northern China

Jan 10, 2014 | AIM Solder is pleased to announce the appointment of Mr. Can Li to the position of Sales Manager. Effective 1 December, 2013, Li will be responsible for AIM’s sales development in the eastern and northern regions of China and will be based in Suzhou, China.

AIM’s International Technical Support Manager, Carlos Tafoya, to present at the IPC Conference on Solder and Reliability in Costa Mesa, CA, November 13, 2013

Nov 08, 2013 | AIM Solder announces today that Carlos Tafoya, International Technical Application Manager, is to present "Alternative Lead-Free Alloys for SMT Assembly" at the IPC Conference on Solder and Reliability: Materials, Processes and Tests, held November 13-14th, 2013 in Costa Mesa, CA. The presentation is scheduled on Wednesday, November 13 at 3:00 pm.

AIM Pleased to be Presented the 2013 Green Supplier Award from Philips Lighting

Jul 10, 2013 | AIM Solder has been recognized by Philips Lighting China with Philips Lighting's 2013 Green Supplier Award during the Philips Lighting China Supplier Day in Shanghai, China in large part due to the company’s participation in the Conflict-Free Tin Initiative (CFTI).

AIM Solder Announces the Release of NC277 VOC-free Liquid Flux

May 13, 2013 | AIM Solder, announces that NC277 is a VOC-free liquid flux that is as electrically safe as an alcohol-based flux and has a medium residue that is suitable for long thermal demands. Winner of a 2013 NPI Award from Circuits Assembly, this halide-free, environmentally safe liquid flux has upon introduction been recognized for exceeding industry standards.

AIM Solder’s NC259 Solder Paste Offers Superior Performance

May 07, 2013 | AIM Solder announces that NC259 Solder Paste is a low-cost, lead-free and halogen-free solder paste that offers superior performance comparable to that of tin/lead and high-silver lead-free solder pastes, a virtual drop-in for costly SAC305.

AIM Solder Announces Appointment of Sales Representative, PHASE 4, Inc.

Apr 30, 2013 | AIM Solder has added PHASE 4, Inc. as its representative for the complete AIM line of solder assembly materials in Arizona and New Mexico.

AIM Solder Announces Appointment of Sales Representative, Rich Sales Co.

Apr 25, 2013 | AIM Solder announces the addition of Rich Sales Co. as its representative for the complete AIM line of solder assembly materials in Arkansas, Louisiana, Oklahoma and Texas.

AIM Solder Receives Environmental ISO 14001:2004 Certification

Apr 19, 2013 | AIM Metals & Alloys LP, announces that its Montréal facility has been awarded ISO 14001:2004 certification in Environmental Management Systems. ISO® (International Organization for Standardization) 14001:2004 is an internationally recognized set of standards that sets out a framework for an organization to develop and implement policies and objectives for setting up an effective environmental management system.

AIM Solder Brings Low-Cost, Lead-Free Solder Paste to NEPCON China 2013

Apr 08, 2013 | AIM Solder will highlight its new NC259 Solder Paste in Booth #1A26 at NEPCON China 2013, scheduled on the 23rd - 25th of April, 2013 at the Shanghai World EXPO Exhibition & Convention Center.

37 more news releases from AIM Solder »

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