NC254 Lead-Free & Tin/Lead Dispensing Solder Paste

NC254 Lead-Free & Tin/Lead Dispensing Solder Paste Description:

NC254 is a lead-free and tin-lead compatible solder paste that offers very good wetting, clear residues and has shown to eliminate voiding under micro-BGAs. 

NC254 has been developed to offer extremely broad process windows for printing, wetting and pin probe testing. The superior wetting ability of NC254 results in bright, smooth, shiny, solder joints. NC254 offers very low post process residues, which remain crystal clear and probable even at the elevated temperatures required for today's lead free alloys. NC254 has shown to reduce or eliminate voiding under micro-BGAs. NC254 also offers high humidity tolerance and a chemistry developed for use in air reflow. Slump and humidity tolerances found in NC254 extend the solder pastes useable life in facilities where environmental control is not at its optimum.

• Lead-Free and Tin-Lead Compatible
• Exceptional Wetting
• Excellent Printing
• Aqueous Clean With Saponifier
• Air Reflow - Nitrogen Not Required
• Available in Industry Standard Sizes