MX2000IR - Wafer AOI

MX2000IR - Wafer AOI Description:

Highly Accurate Fully Automatic Wafer Inspection with Handling Unit

For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need non-destructive inspection for surface purity and evenness. Inspecting for defects beneath the surface is also especially important, as is measurement of features such as die bonds and sealing adhesive on MEM components (e. g. sensors). The Viscom inspection system MX2000IR takes on these tasks. One especially important application area is the 100 % inspection of all safety-critical components, with the wafers automatically loaded and unloaded by a handling unit.

Viscom MX2000IR Highlights:

• Infrared illumination – both transmitted and reflected light
• Infrared light sources have a very long life span, are scalable, have high performance capabilities and guarantee exceptionally high resolution
• High throughput
• Non-destructive testing (NDT) on and in the wafer
• Automatic wafer identification reading and pre-alignment are done parallel to the inspection
• Direct identification of each wafer by code reading (barcode, data matrix code, OCR)
• Offline programming station available in many languages
• Automatic loading and unloading make the system ideal for medium to large lot sizes. For 150 and 200 mm wafers, up to four cassetes holding a maximum 25 wafers each can be automatically loaded. For 300 mm wafers, four FOUP stations (Front Opening Unified Pod) are available

The MX2000IR is the ideal solution for the inspection of bare wafers, chips, MEMS, wafer bonds, SOI and FlipChips, as well as applications in the photovoltaic area. Wafers inspected can be composed of various materials: silicon, gallium arsenide, III-V materials and others. In 20 seconds to several minutes depending on wafer size and resolutions the MX2000IR can, utilizing transmitted and reflected IR light, provide structural analysis and foreign body data for MEMS devices.

The heart of the Si-Thru technology are the infrared light sources (Semiconductor Light Matrix: SLM). These light sources emit light at a specific wavelength (around 1 μm), a highly efficient infrared light in a narrow spectrum that is superbly adapted to semiconductor inspection applications. The light sources have a long service life, are scalable, have very high performance and guarantee a high resolution. They facilitate a unique detection of embedded defects. The IR camera head is precisely positioned for image capture by an X/Y/Z unit.

A robot automatically loads and unloads the wafer for inspection. The MX2000IR system is especially well suited for inspection of medium to large lot sizes. One to four cassettes with up to 25 wafers each can be loaded automatically without any human contact. To increase efficiency, code reading and pre-alignment are done in parallel with inspection.

The graphical user interface makes program generation and maintenance quick and easy. Many different languages can be chosen on the off-line programming station. Evaluation is based on specialized inspection algorithms to localize defects including voids, bond widths, delaminations and others. Integration of code reading (barcode, data matrix code, OCR) directly identifies each individual wafer. Statistical analysis process control is also provided.

Worldwide service at the highest level

Experienced Viscom employees in Hanover and the international branch offices, as well as many international agents, support our customers worldwide. In Service alone, since 2009 a great number of flexible and highly trained employees were consolidated into a separate division. The offering includes routine servicing, troubleshooting, maintenance, calibration service and modernization, among others. Visit our website to find international subsidiaries and representatives in Europe, USA and Asia.