Summit II High Performance Rework Systems

Summit II High Performance Rework Systems Description:

The Latest in High Performance Rework Systems.

Summit II combines the latest rework technologies and ergonomics with the throughput, accuracy and reliability of the renowned Summit product family. Summit II features a reduced footprint, yet larger board capacity with easy to adjust board support fixtures. Enhanced SierraMate software takes the popular user-friendly operation to the next level with a simple icon driven GUI and unmatched flexibility through easily customized operation sequences.

• Max. Board Size > 20 X 20 in. (508 mm X 508 mm)
• Min. Component Size 0.005" (0.12mm)
• Placement 0.0005" (12μ) mean + 3σ
• Compliance CE, ANSI/UL 61010, CAN/CSA C22.2
• Top Heater 2.0 kW
• Site Heater 1.0 kW
• Bottom Heater 5.6 kW
• Field-of-View 2.6" (65 mm) Square

Carrying on with the Summit legacy for reliability and uptime, the Summit II is designed for years of continuous use. Improved lighting and optics make alignment of difficult components, even 01005s, easier than ever. Digital gas flow control provides optimized reflow profiles for everything from micro passive devices and PoP components through the largest DIMM connectors. The enhanced side-view camera allows the operator to watch the rework process up close.

The Summit II Features

• Reduced footprint with larger board capacity
• Simplified Graphical User Interface
• Closed loop control of heater gas flow
• Ultra High Flow for large connectors and multiple BGA rework
• Nested Top Heater and independent pickup tube travel
  • Allows nozzle to gasket the board
  • Support zero force (clean) component removal
• Improved quick-release nozzle and pick up tube exchange
• Differential TC inputs - eliminates signal noise