Mark II PCB Through Hole Plasma Etch Back and Desmear System

Mark II PCB Through Hole Plasma Etch Back and Desmear System Description:

MK-II Plasma Desmear and Etch Back System

The MK-II plasma etching system offers technological advantages such as the unique combination of process temperature control and electrostatic shielding. Both work in harmony to produce the most consistent, most uniform, and most reliable etch rates obtainable across an entire board's surface.

The Mark II is a purpose-built system for PCB Through Hole Desmear and Etch Back.

All of our systems are excellent choices for use in industrial clean room settings as a plasma etching system.

Standard Features

Electrode Configuration

Default 24"Wx18"D (Several Optional Configurations) 6, 8, 12, 16 and 24-Shelf Systems Available

Generator

1250W to 5000W - 13.56MHz Continuously Variable Power Supply with Automatic Matching Network

Gas Control

Two 0-2000cc Mass Flow Controllers with Low Gas Source Alarm

Control System

Color PLC-Based Touch Screen Control Interface; Stores Multiple Three-Step Recipes

Vacuum Gauge

1-2000 mT

Vacuum Pump

29CFM - 56CFM 2-Stage Direct Drive Oil Pump (Oxygen Service – Krytox Charged)
    - with -
   Two Point Vacuum Pump Purge System
    3 Micron Oil Filtration System
   Oil Mist Eliminator
   - or -
   56CFM Dry Pump 
   355CFM or 845CFM Blower Booster

Chamber Material

6061-T6 Aluminum

Unit Dimensions

66”x79”x26”

Additional Features

Temperature Control System

Made in the U.S.A.

Optional Features

Most systems can be customized with a wide range of options including:

Custom Sized Vacuum Chamber, Number/Size of Electrodes

To ensure your system is able to specifically meet your throughput requirements

Reactive Ion Etching Electrodes

Enables reactive ion etching

KHz/MHz Power Supplies with Automatic Matching Network

Higher watt or different frequency power supplies

PC-based Control System

For fully automatic system control, multi-step process sequencing, multiple recipe storage, data logging/trending, events/alarms, etc.

Electrostatic Shielding

Greatly increases process uniformity across each shelf by eliminating excess etching at the outer bounds of the processed material

Temperature Control System

To maintain specific temperatures in the processing chamber for enhanced uniformity between shelves and application-specific needs

Dry and Oil-Driven Vacuum Pumps and Blower Boosters

A variety of vacuum pump options for more control over the process chamber pressure

Chiller System for Dry Vacuum Pump

Necessary for the operation of a dry vacuum pump

Chamber and Vacuum Pump Purge Systems / Air Dryer / Purge Gas Generator

To ensure thorough removal of contaminants from the etching system, providing uniformity and increasing longevity

Vacuum Pump Oil Mist Eliminator

Captures oil from vacuum pump exhaust

Vacuum Pump Oil Filtration

Filters the vacuum pump oil down to a 3 micron level which increases the longevity of the oil and the vacuum pump

Automatic Vacuum Control

Provides automation of the process chamber pressure

Additional Digital Mass Flow Controllers

Provides digital automation and monitoring of process gases

Software Configurable Gas Steering Matrix

Designed to allow for up to 5 process gas inputs; up to 3 are selectable at any time by software driven controls

Low Gas-Source Alarm

Notification for when your process gas container needs replenished

Light Tower

For easy visualization of the steps of the plasma processing sequence

Fume Scrubber

To eliminate hazardous fumes/contaminants from the chamber/vacuum pump exhaust of the etching system

For More information about any of our systems, please call us at 775-883-1336 or visit: www.plasmaetch.com