Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Manufacturer

Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, performs, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®.

Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

Indium Corporation Postings

10 products »

Durafuse™ LT - Low Temperature Solder Paste

Durafuse™ LT is a novel, low-temperature alloy system designed to provide high-reliability in low applications that are looking for a reflow temperature below 210°C. Where traditional low-temperature solders often...

Solder Materials

Durafuse™ LT - Low Temperature Solder Paste

Indium6.4R Water-Soluble Pb-Free Solder Paste

Indium6.4R is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It excels in both SnPb and Pb-free assembly processes, providing an exceptional reflow process window. This solder paste delivers outstanding stenci...

Solder Materials

Indium6.4R Water-Soluble Pb-Free Solder Paste

NanoFoil® Multi-Layer Bonding Material

NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provide...

Materials

NanoFoil® Multi-Layer Bonding Material

Indium8.9 Pb-Free Solder Paste

Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy system...

Solder Materials

Indium8.9 Pb-Free Solder Paste

SACM™ Soldering Alloy

Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Addit...

Solder Materials

SACM™ Soldering Alloy

Solder Spheres

New Precision BGA Spheres Optimize Sphere Performance Indium Corporation’s Solder Spheres for PBGA, CBGA, TBGA, µBGA¬ and Flip Chip applications are made by a proprietary manufacturing process that consistently resu...

Solder Materials

Solder Spheres

Indium Solder Wire

Solder Wire from the Indium Corporation is made to demanding quality standards. Our flexible manufacturing process allows us to fulfill orders from evaluation/research quantities to full scale production volumes. Indium Solde...

Solder Materials

Indium Solder Wire

Indium Solder Pastes

Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to g...

Solder Materials

Indium Solder Pastes

Solder Preforms

Preforms come in standard shapes such as squares, rectangles, washers and discs. Typical sizes range from .010" (.254mm) up to 2" (50.8mm). Smaller and larger sizes, as well as custom shapes, are also available. Dimensions can be held...

Solder Materials

Solder Preforms

Flux and Epoxy Products

Indium Corporation is a developer, manufacturer, and global supplier of: specialty solders (including solder paste, preforms, spheres, columns, wire, tubing, ribbon, and foil), fluxes, electrically-conductive adhesives, inorganic compounds (inc...

Solder Materials

Flux and Epoxy Products

27 technical articles »

D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding

Dec 29, 2020 | Kim Flanagan and Greg Wade

Voiding in bottom termination components (BTCs) like QFNs and LGAs have become quote the hot topic in the SMT industry. Surprisingly, one type of BTC component that is observed to have excessive amounts of voiding is the DPAK. One would think that a component with leads located on only one side would mitigate flux entrapment and allow outgassing to escape more easily from beneath the component, as compared to other BTCs where the component is affixed to the PCB on two or more sides. However, the exact opposite has been observed in most cases....

The Risk And Solution For No-Clean Flux Not Fully Dried Under Component Terminations the Risk And Solution For No-Clean Flux Not Fully Dried Under Component Terminations

Nov 24, 2020 | Fen Chen and Ning Cheng Lee, Ph.D.

The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology....

Voiding Performance with Solder Pastes Containing Modified SAC Alloys for Automotive Applications in Bottom Terminated Component Assemblies

Jul 24, 2019 | Brook Sandy-Smith

Voiding is a key concern for components with thermal planes because interruptions in Z-axis continuity of the solder joint will hinder thermal transfer. When assembling components with solder paste, there is a high propensity for voiding due to the confined nature of the solder paste deposits under the component. Once reflowed, many factors contribute to the amount of voiding in a solder joint such as the reflow profile, designs of the component, board and stencil, and material factors. This study will focus on the solder paste alloy and flux combination as well as profile and board surface finishes....

Process Optimization for Fine Feature Solder Paste Dispensing

Dec 19, 2018 | Maria Durham, Greg Wade, and Brandon Judd; Indium Corporation, John Boggiatto; ITW EAE - Speedline Technologies

With the rapid trend towards miniaturization in surface mount and MEMs lid-attach technology, it is becoming increasingly challenging to dispense solder paste in ultra-fine dot applications such as those involving chip capacitors or BGA packages, as well as dispensing ultra-fine lines in MEMs lid-attach applications. In order to achieve ultra-fine dots and fine line widths while dispensing solder paste, both the solder material and dispensing equipment need to be optimized. Optimizing the equipment can be very challenging, as there are many input variables that can affect the dispense quality of the solder paste. In this paper we will evaluate the many equipment variables involved in the solder paste dispensing process, and the impact these variables have on the dispense quality of the solder paste....

Understanding the Effect of Different Heating Cycles on Post-Soldering Flux Residues and the Impact on Electrical Performance

Nov 20, 2018 | Brook Sandy-Smith, Indium Corporation and Terry Munson, Foresite Inc.

There are several industry-accepted methods for determining the reliability of flux residues after assembly. The recommended methods of test sample preparation do not always closely mimic the thermal cycle experienced by an assembly. Therefore, extraction from actual assemblies has become a popular method of process control to assess consistency of post-reflow cleanliness. Every method of post-reflow flux residue characterization will depend on the reflow process followed to prepare the coupon.

This investigation will focus on the effect of thermal conditions on the remainder of active ingredients in flux residues after assembly with no-clean solder pastes....

Does Thermal Cycling Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue

Aug 29, 2018 | Eric Bastow

No-clean solder pastes are widely used in a number of applications that are exposed to wide variations in temperature during the life of the assembled electronics device. Some have observed that cracks can and do form in flux residue and have postulated that this is the result of or exacerbated by temperature cycling. Furthermore, the potential exists for the flux residue to soften or liquefy at elevated temperatures, and even flow if orientated parallel to gravity. In situations such as in automotive electronics, where significant temperature cycling is a reality and high reliability is a must, concern sometimes exists that the cracking and possible softening or liquefying of the residue may have a deleterious effect on the electrical reliability of the flux residue. This paper will attempt to address this concern....

A Novel Solution for No-Clean Flux not Fully Dried under Component Terminations

Aug 17, 2017 | Dr. Ning-Cheng Lee & Fen Chen

At SMT assembly, flux outgassing/drying is difficult for devices with poor venting channel, and resulted in insufficiently dried/burnt-off flux residue for no-clean process.

Examples including:

  • Large low stand-off components such as QFN, LGA
  • Components covered under electromagnetic shield which has either no or few venting holes
  • Components assembled within cavity of board
  • Any other devices with small open space around solder joints
...

A Novel Epoxy Flux On Solder Paste For Assembling Thermally Warped POP

Aug 17, 2017 | Ming Hu, Lee Kresge, and Ning-Cheng Lee

A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes, and imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting channel. The compatibility enables a single bonding step for BGAs or CSPs, which exhibit high thermal warpage, to form a high-reliability assembly. Requirements in drop test, thermal cycling test (TCT), and SIR are all met by this epoxy flux, EF-A. The high viscosity stability at ambient temperature is another critical element in building a robust and userfriendly epoxy flux system. EF-A can be deposited with dipping, dispensing, and jetting. Its 75°C Tg facilitates good reworkability and minimizes the adverse impact of unfilled underfill material on TCT of BGA assemblies....

Establishing a Precision Stencil Printing Process for Miniaturized Electronics Assembly

Jun 13, 2017 | Chris Anglin

The advent of miniaturized electronics for mobile phones and other portable devices has required the assembly of smaller and smaller components. Currently 01005 passives and 0.3 mm CSPs are some of the components that must be assembled to enable these portable electronic devices. It is widely accepted that about 65% of all end of the line defects occur in the stencil printing process. Given all of the above, it is critical that a precision stencil printing process be developed to support miniaturized electronic assembly.

This paper is a summary of a significant amount of experimental data and process optimization techniques that were employed to establish a precision SMT printing process....

Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue?

Feb 09, 2017 | Eric Bastow

The SMT assembly world, especially within the commercial electronics realm, is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very attractive in a competitive world where every penny of assembly cost counts. One important aspect of the reliability of assembled devices is the nature of the no-clean solder paste flux residue. Most people in this field understand the importance of having a process that renders the solder paste flux residue as benign and inert as possible, thereby ensuring electrical reliability.

But, of all the factors that play into the electrical reliability of the solder paste flux residue, is there any impact made by the age of the solder paste and how it was stored? This paper uses J-STD-004B SIR (Surface Insulation Resistance) testing to examine this question....

17 more technical articles from Indium Corporation »

357 news releases »

Indium Corporation, KATEK to Present Joint Process Development at SMTconnect

May 05, 2022 | Indium Corporation expert Andreas Karch, regional technical manager and technologist – advanced applications, and Ralf Sedlatschek, head of technology, KATEK Group, will co-present their joint process development on a materials solution to prevent hotspots in thermally-critical components at SMTconnect, May 10, 11:40 a.m.-Noon, Nuremberg, Germany.

Indium Corporation Experts to Present at PCIM e-Mobility Forum

Apr 28, 2022 | Indium Corporation experts will share their technical insight and knowledge on automotive and electric vehicle (EV) materials solutions as part of an e-Mobility forum at PCIM Europe, May 10-12, Nuremberg, Germany.

Indium Corporation Expert to Present at Electronic Components and Technology Conference

Apr 28, 2022 | Indium Corporation® Principal Engineer and Manager for Thermal Interface Materials Applications Andy Mackie, Ph.D., MSc, will share his technical expertise and insight on solder thermal interface material (TIM) processes at Electronic Components and Technology Conference (ECTC) taking place May 31-June 3, in San Diego, Calif., U.S.

Indium Corporation Expert to Present at SiP Conference China

Apr 28, 2022 | Indium Corporation®'s Leo Hu, senior area technical manager – East China, will share the challenges and solutions of fine feature solder paste printing for system-in-package (SiP) at SiP Conference China, May 19, Shanghai, China.

Indium Corporation to Present on e-Mobility at SMTA Michigan

Apr 20, 2022 | Indium Corporation's Brian O'Leary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving electric vehicle (EV) landscape at the SMTA Michigan Expo & Tech Forum at 9 a.m. local time, Tuesday, May 17, Livonia, Mich., U.S.

Indium Corporation Introduces New Adhesive Solution for Semiconductor Applications at PCIM Europe

Apr 20, 2022 | Indium Corporation is announcing the release of InTACK™, a drop-in, robust tacking agent for power module assembly at PCIM Europe, May 10-12, Nuremberg, Germany.

Indium Corporation's Dr. Ron Lasky to Present on Design of Experiments in Upcoming Webinar

Apr 13, 2022 | Indium Corporation's Dr. Ron Lasky will share his technical insight on the importance of Design of Experiments to optimize the electronics assembly process as part of the company's popular InSIDER Series of webinars. The presentation, Design of Experiments (DOE) for SMT 101, will take place on Tuesday, May 3, at 10:30 a.m. San Francisco/1:30 p.m. New York/6:30 p.m. London/7:30 p.m. Germany.

Indium Corporation President to Deliver TestConX Keynote on Materials Science Innovations

Apr 13, 2022 | Indium Corporation's Ross Berntson, President and COO, will deliver the keynote presentation at TestConX, to be held May 1-4, in Mesa, Ariz., US.

Indium Corporation's Dr. HongWen Zhang to Present InSIDER Series Webinar

Apr 06, 2022 | Indium Corporation's Alloy Group R&D Manager Dr. HongWen Zhang will deliver a presentation on the company's award-winning Durafuse™ mixed-alloy technology as part of its popular InSIDER Series of webinars. The presentation, titled Solder Challenges and Product Development with Durafuse™ Technology, will be given on Wednesday, April 27 at 8 a.m. San Francisco/11 a.m. New York/4 p.m. London/5 p.m. Germany.

Sixteen Indium Corporation¬ Experts Certified by SMTA

Apr 06, 2022 | Indium Corporation is pleased to announce that 16 employees have earned SMTA certification as part of its ongoing mission to invest in its technical talent to ensure customer success through professional development.

347 more news releases from Indium Corporation »

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