LaserVision SP3D Mini - Benchtop 3D Solder Paste Inspection System

LaserVision SP3D Mini - Benchtop 3D Solder Paste Inspection System Description:

The LaserVision Mini SP3D system combines laser measurement accuracy with Automatic Data Collection (ADC) for real-time control of the SMT stencil printing process. With its Windows® 7+ Pro OS and service free USB interface, the Mini SP3D system is easy to learn and operate, making it the most cost effective SPI solution for the SMT manufacturer concerned with improving printing quality and production yields.

Features

• Accurate and Repeatable Measurements of Solder Paste, Adhesives, Grease and Other Applications
• Automatic Calculation of Height, Area, Width and Volume Measurements
• Fully Integrated Real Time SPC Run Charts and Histograms
• Customized Data Reports with Data Tag Traceability
• 4 Unique and Flexible Operating Modes
• Simple USB Interface for Service Free Maintenance
• One-year warranty

Automated Measurements

To obtain automated measurements on the SP3D, position the circuit board under the system’s laser-based vision sensor to the desired location. Simply click the green run button to automatically calculate the solder paste height, width, area and volume. Automated measurements reduce the errors associated with operator to operator variations.

3D Scanning Laser

The SP3D’s optional laser scanning feature provides 3D profiling capabilities along with added accuracy and repeatability due to increased data acquisition. This feature also provides a second layer of analysis to establish proper corrective actions based upon qualitative defect attributes and 3 dimensional renderings that can be manipulated, tilted and viewed from multiple angles.

Customized Data Reports

The onboard SPC software is a powerful tool that helps operators control the critical stencil printing process. Data collected by the SP3D is instantly charted by the integrated SPC software. Calculations crucial to the printing performance are managed by the following information:

• User Defined LSL, Target and USL
• X-bar / R and Histogram Charting
• Min / Max / Median Values
• Cp / Cpk / Cr and Lower Z Values

System Specifications

• Maximum Object Thickness 3.8 cm (1.5”)
• Standard work Surface (WxL) 61 cm x 61 cm (24” x 24”) (not including system pc and monitor)
• Throat depth (laser to rear support) 22 cm (8.5”) Can be Increased
• System Computer (Optional) 2.5+ GHz – 64+ MB RAM
• Electrical Requirements 100-240 VAC, 50-60 Hz, 2 Amps
• Ambient Operating Temperature +5° to +38° C (+40 to 100 F)
• Ambient Operating Humidity <90% non-condensing
• System Weight* (crated) 40 Kg (88 lbs)
• System Weight* (un-crated) 18 Kg (40 lbs)

Sensor Specifications

• Laser Type 1 mW, 670 nm laser diode
• Resolution 2.54 μm (0.10mil)
• Integral Video Camera CMOS Color Camera
• Field of View (Standard View) 4.7 mm x 3.6 mm
  186 mils x 142 mils
• (Zoom View) 2.4 mm x 1.8 mm
  96 mils x 72 mils