Profile Planner - Reflow Profiling Software

Profile Planner - Reflow Profiling Software Description:

Match Solder Paste Specifications and Oven Configurations to Provide Robust Process Profiles...

The Profile Planner is an Microsoft® Excel Workbook Application that allows you to match Solder Paste specifications and Oven specifications. You can then see the Profile that will be generated and how well it will conform to the paste manufacturers specification.

From the introduction screen you can:

• Add a Paste
• Add an Oven
• Select an Oven and Paste combination and see the Profile

The tabs along the bottom allow you to navigate to the:

• Solder Paste Specifications Database
• Oven Configuration Database
• Robust Profile Calculator
• Robust Profile Graph
• Instructions An abstract of Bob Rooks paper which is the foundation for the Profile Planner

The profile planner provides:

• Time above liquidous
• Best zone distribution between ramp, soak and spike regions
• Printed solutions, and paste profiles
• Ramp rates, soak and dwell times