VT-X700 E/L In-Line Automated X-Ray Inspection
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VT-X700 E/L In-Line Automated X-Ray Inspection Description:
The 3D-CT method enables the inspection of indistinct shapes which 2D or pseudo CT cannot detect. Making the impossible in design a reality!
The Omron VT-X700 is the perfect solution to manufacturers desiring high-speed, in-line, automated X-Ray inspection on PCBs containing components such as BGAs or CSPs with hidden solder joints. Traditional AOI technology is incapable of inspecting these types of components but the VT-X700 uses revolutionary, high-precision, X-ray, CT imaging to perform precise and reliable analysis of these hidden areas.
The VT-X700 is capable of inspecting solder quality on a full-range of components from BGAs to chips and even through-hole devices. Inspections are performed very quickly at speeds of only 5 seconds per field-of-view (fov).
By using 3D reconstruction software and laser displacement technology, the VT-X700 gauges the PCB surface for each solder-joint, compensating for any warpage and allowing the system to perform cross-sectional analysis at the proper slice-level locations.
Selectable resolutions of 10, 15, 20, 25 or 30 microns combined with selectable numbers of X-Ray projections (up to 128) allow for user-driven variation between higher inspection speeds for production environments to ultra-high quality 3D image acquisition for research and defect analysis.
- High-Precision, X-Ray, Angled 3D CT Imaging
- Fast and Accurate Automated Inspection
- User-Friendly Software and Interface
- Full Offline Program Generation
- Automatic Component Model Creation for Quick and Easy Programing
- Real-Time Process Monitoring
- Defect Checking Terminal and 3D Image Reviewing Software
- Data Analysis and Quality Control Software Tools
- Safe and Secure Closed X-Ray Tube
- Pulse-Shot X-Ray Method for Extended X-Ray Source Life
- Omron's World Class Service and Support
3D-CT Method
The cross-sectional images of relevant inspection targets can be easily selected from abundant camera-image libraries to ensure precise fault detection.
High-Output X-Ray Source
Inspection of large-thickness PCBs and power devices is possible by combining a proprietary CT structuring technology with a high-output X-ray source.
Compatibility with L-Sized (610 mm × 610 mm) PCBs
Compatible with large-sized PCBs such as those used by network base stations.
High-speed
10% Reduction in Inspection Tact Time (Internal Comparison)
- World's highest CT speed* thanks to our patent-approved technologies.
- New imaging system reduced inspection tact times by 10% compared with conventional systems.
- Enabled the complete inspection of all components (almost impossible by visible light-based inspection).
Global Support
More than 30 locations.
VT-X700 E/L In-Line Automated X-Ray Inspection was added in Apr 2019
VT-X700 E/L In-Line Automated X-Ray Inspection has been viewed 294 times
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