Heller Industries Inc.
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
i4.0 Today caught up with Marc Peo of Heller Industries at IPC Apex Expo in San Diego, to discuss the IPC CFX initiative.
Heller Industries, the market leader in Reflow Soldering technology, supplies solutions for electronics manufacturers and assemblers worldwide.
Advanced manufacturing and production systems that supply both standard and special reflow ovens cost-efficiently, with rapid delivery. These capabilities are supported by corporate and fiscal strength, the result of consistency in management policies and engineering expertise over the past 42 years.
Our company-wide ISO 9001 program enhances communication within and among departments - as well as throughout our global network of regional managers, sales representatives, field service engineers and customers. The cohesive management team ensures valuable continuity; the people you speak with today have a heritage and a future with the company. Our entire staff is grounded in engineering principles. This shared experience provides support in executing the company's various functions: assembly, design, service or quality assurance.
Since we introduced our first full convection reflow oven in 1987, Heller Industries has brought innovations and refinements to market at an accelerating rate. In the course of responding to forces that impel electronics assemblers to reduce their product development cycles, Heller has amassed considerable expertise in resolving reflow and curing issues. Having pioneered full convection reflow -now the standard of the industry - we have met, and continue to accept, major engineering challenges.
Heller Industries Inc. Postings
9 products »
Convection Reflow Oven The World's Best Convection Reflow Oven for High-Throughput The New reflow oven platform revolutionizes the...
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative...
High Volume Reflow Oven - 1936/2043 Mark5
The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems....
Dual Lane / Dual Temperature SMT Reflow Oven - 1910 MK5
Dual Chamber Module - Dual Chambers + Dual Blowers + Dual Heaters + Dual T/Cs. Bifurcated (Dual) chamber reflow oven allows 2 different thermal profiles to run simultaneously in the same reflow oven foot pr...
Voidless / Vacuum Reflow Soldering Oven - 1809 MK5
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry!&...
Flux Free Formic Acid Reflow Oven - 1936 MKV
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to...
860 Pressure Curing Oven (PCO)
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a...
Vertical Curing Oven - Heller 788
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of fl...
Vertical Curing Mini Oven - Heller 755
The mini vertical oven has a cycle time of 25 - 60 seconds per 150mm fixture, 4mm Edge Hold Pins and Guides. PCBs up to 250mm wide can be processed. Dual Feed option for high throughoutput. In-line, vertical automation...
9 Marketplace items »
2 technical articles »
Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum
Jan 28, 2020 | Heller Industries
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers....
Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow
Jul 10, 2019 | M. Barnes, D.W. Lee, D. Heller - Heller Industries, M.Holtzer, T. Cucu - Alpha Assembly Solutions, J. Fudala, J. Renda - MacDermid Enthone Electronic Solutions
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation....
21 news releases »
Heller Industries Will Feature the MK7 Reflow Oven Featured at IPC APEX 2022 Booth #1920
Nov 08, 2021 | Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.
Heller Industries Proud Recipient of 2021 Service Excellence Award for Soldering Equipment
Apr 14, 2021 | The 2021 Service Excellence Award for Soldering Equipment was given to Heller Industries. Circuits Assembly recognizes companies that receive the highest customer service ratings, as judged by their own customers.
Soldering Company of the Year 2020 - Heller Industries
Nov 03, 2020 | 2020 Global Surface Mount Technology Company Of The Year Award (Soldering Equipment)
Heller Industries Commended by Frost & Sullivan for Delivering Unmatched Customer Value through Its Reflow Soldering Technology
Dec 09, 2019 | The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
i4.0 Connect Forum - Fremont Marriott Silicon Valley
Sep 12, 2019 | Learn first-hand the experiences, challenges and solutions our leaders are taking to achieve truly smart manufacturing.
Attention all USA Customers. No 25% Import Duty on Heller Reflow Ovens
Jul 02, 2018 | Heller Industries Announces That It Will NOT Be Subject To The 25% Import Duty on Reflow Oven Purchases
SMT Soldering Equipment Reflow Tool for Industry 4.0 - Frost & Sullivan Award
Sep 16, 2017 | Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Frost & Sullivan Lauds Heller Industries' Exceptional Growth Borne of its Advanced SMT Reflow Soldering Equipment for Industry 4.0
Jun 22, 2016 | Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Lean Stream & Heller Reflow Technology to Partner in CA & NV
Nov 12, 2015 | Heller Industries is thrilled to announce that we've partnered with the #1 Northern California Sales Representative Group - Lean-Stream!
Heller Industries Mark 5 Wins 2015 SMT China Vision Award
May 18, 2015 | Heller Industries has been awarded a 2015 SMT China Vision Award in the category of Reflow Soldering for its 1936 Mark 5 Reflow Oven. The award was presented during April 21, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China 2015.