MICRONOX MX2302 Semiconductor & Advanced Assembly Cleaning Solution

MICRONOX MX2302 Semiconductor & Advanced Assembly Cleaning Solution Description:

MICRONOX MX2302 is an engineered semi-aqueous solvent blend designed to remove difficult flux and paste residues from wafer bumps found in die-attach, flip chip, copper pillar, and emerging semiconductor assemblies. MX2302 is used as received in all immersion cleaning systems including; semi-aqueous centrifugal, spray under immersion, ultrasonic and mega-sonic systems. MICRONOX MX2302 is compatible with all soldering materials and metal layers as well as materials of construction common in the production and cleaning of assemblies.

A major benefit of MICRONOX MX2302 is its complete water solubility, which enhances the ease of rinsing and removal of ionic contamination. MX2302 has a low vapor pressure that reduces concerns of flammability and smell. MICRONOX MX2302 has a low surface tension of 20-26 dynes/cm improving cleaning under the Z-axis of the component or package and is buffered to maintain a stable pH.

Application:

• WAFER BUMPING CLEANING

Typical Process

• Process: All Immersion Systems
• Concentration: 100%
• Temperature: <165°F / 74°C
• Rinse: DI Water Rinse
• Dry: Hot Air

Properties

• pH (10g/L): N/A (Solvent-Based)
• Flash Point: 180°F / 82°C
• Boiling Point: 302°F / 150°C
• Water Soluble: Complete
• VOC, @ 100% 1035 g/L

MICRONOX products are semiconductor grade cleaning chemistries for defluxing and particulate removal for the Advanced Packaging, Microelectronics and Semiconductor industries.

Other KYZEN's Cleaning Products:

• AQUANOX line of chemistries are concentrated aqueous cleaning chemistries designed for the Electronic Assembly, Aerospace and Automotive industries.  Each product in the line has been specially formulated for a variety of cleaning processes and purposes such as cleaning circuit boards and printed circuit board cleaning.
• IONOX products are semi-aqueous and solvent cleaning chemistries designed to remove tough soils from electronic assembly and advanced packaging products.
• CYBERSOLV products are specially formulated for superior performance in benchtop, stencil and maintenance cleaning. Whether for rework, oven cleaning or stencil cleaning CYBERSOLV will outperform anything in its class.
• KYZEN E products offer a variety of cleaning solutions for stencils, pallets, and various maintenance applications to remove burned-on fluxes and solders commonly used in electronics assembly manufacturing.
• CP line of corrosion protection products offer long term protection for a variety of metals. KYZEN CP products are used to inhibit metal parts while enhancing the removal of a wide range of organic and inorganic soils and provide up to 90 days of inhibition and under some conditions beyond.
• Solstice Performance Fluid (PF, PF-2A, and PF-HP) are fluorinated solvents that provide exceptional cleaning power and satisfy long-term environmental and safety requirements. Solstice PF solvents have been specially formulated for a variety of cleaning needs and purposes for use in multiple applications such as electronics, metal finishing, and oxygen systems cleaning. Solstice PF has been identified as a replacement for a high-environmental-impact solvent currently used in NASA test facilities. Solstice PF is the recommended chemistry replacement for AK225.
• The KYZEN Line of Process Enhancement products are ancillary products developed to enhance and support the superior performance of all KYZEN Cleaning Chemistries used in Electronic Assembly, Metal Finishing, Aerospace, and Automotive industries.