MICRONOX MX2322 Semiconductor & Advanced Packaging Cleaning Chemistry

MICRONOX MX2322 Semiconductor & Advanced Packaging Cleaning Chemistry Description:

MICRONOX MX2322 is a semiconductor grade semi-aqueous solvent that is designed to clean all types of paste fluxes common in wafer bumping, wafer-level packaging, die-attach, flipchip and SiP containing copper pillar. MICRONOX MX2322 demonstrates its excellent cleaning performance and benefits in single-wafer spray-in-air tools as well as all immersion cleaning systems.

MICRONOX MX2322 is used as received and rinses quickly and cleanly with DI water. MX2322 has a wide process window, as well as a long bath life providing a low cost of ownership. MICRONOX MX2322 has proven superior compatibility on exposed sensitive metals including aluminum, copper and nickel as well as passivation materials.

Application:

• Back End Wafer and Wire Bonding

Typical Process

• Process: Immersion Systems
• Concentration: 100%
• Temperature: <165°F / 74°C
• Rinse: DI Water Rinse
• Dry: Hot Air

Product Properties

• pH (10g/L): N/A (Solvent-Based)
• Flash Point: 208°F / 98°C
• Boiling Point: 343°F / 173°C
• Water Soluble: Partial
• VOC, @ 100% 1001 g/L

MICRONOX products are semiconductor grade cleaning chemistries for defluxing and particulate removal for the Advanced Packaging, Microelectronics and Semiconductor industries.

Other KYZEN's Cleaning Products:

• AQUANOX line of chemistries are concentrated aqueous cleaning chemistries designed for the Electronic Assembly, Aerospace and Automotive industries.  Each product in the line has been specially formulated for a variety of cleaning processes and purposes such as cleaning circuit boards and printed circuit board cleaning.
• IONOX products are semi-aqueous and solvent cleaning chemistries designed to remove tough soils from electronic assembly and advanced packaging products.
• CYBERSOLV products are specially formulated for superior performance in benchtop, stencil and maintenance cleaning. Whether for rework, oven cleaning or stencil cleaning CYBERSOLV will outperform anything in its class.
• KYZEN E products offer a variety of cleaning solutions for stencils, pallets, and various maintenance applications to remove burned-on fluxes and solders commonly used in electronics assembly manufacturing.
• CP line of corrosion protection products offer long term protection for a variety of metals. KYZEN CP products are used to inhibit metal parts while enhancing the removal of a wide range of organic and inorganic soils and provide up to 90 days of inhibition and under some conditions beyond.
• Solstice Performance Fluid (PF, PF-2A, and PF-HP) are fluorinated solvents that provide exceptional cleaning power and satisfy long-term environmental and safety requirements. Solstice PF solvents have been specially formulated for a variety of cleaning needs and purposes for use in multiple applications such as electronics, metal finishing, and oxygen systems cleaning. Solstice PF has been identified as a replacement for a high-environmental-impact solvent currently used in NASA test facilities. Solstice PF is the recommended chemistry replacement for AK225.
• The KYZEN Line of Process Enhancement products are ancillary products developed to enhance and support the superior performance of all KYZEN Cleaning Chemistries used in Electronic Assembly, Metal Finishing, Aerospace, and Automotive industries.