HTCC QFN Packages

Company Information:

Designer and manufacturer of semiconductor packaging and resistive components including terminations, resistors and attenuators.

Attleboro, Massachusetts, USA

Manufacturer

(508)226-3350
(508)226-3317

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Company Postings:

(1) used SMT equipment marketplace item

(3) products in the catalog

(10) news releases

Name:	HTCC QFN Packages
Category:	Components
Offered by:	Barry Industries, Inc.

HTCC QFN Packages Description:

HTCC QFN Packages to 40GHz

High Temperature Co-Fired Ceramic (HTCC) QFN packages from Barry Industries feature low-loss broadband transitions for superior performance over frequency. HTCC construction provides for enhanced mechanical strength and higher thermal conductivity compared with LTCC. These hermetically sealable packages conform to JEDEC MO-220 footprints. Lids are available from the factory.

6 Sizes: 3mm to 8mm
Alumina or AlN Construction
Bare or Grounded Seal Ring
Custom Designs Available

HTCC QFN Packages was added in Oct 2013

HTCC QFN Packages has been viewed 1060 times

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