Hybrid
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Hybrid |
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Hybrid Description:
A single machine solution for WLP manufacturing. Flip Chips, Bare dies or SMD’s can be mounted on wafers up to 300 mm or panels up to 800 mm length.- Accuracy up to 7 µm CpK > 1.0
- Ultra-low placement defect levels; below 1 dpm
- Output up to 140 K
- 0201m/008004 capability
- Placing thin components without cracking
- Full control of your process
- Full traceability
Hybrid was added in Oct 2021
Hybrid has been viewed 46 times
