SPI 2500 3D Solder Paste Inspection System

SPI 2500 3D Solder Paste Inspection System Description:

The SPI 2500 is the next generation of off-line solder paste inspection system and features cost effective solution with the best accuracy.

• The optimal solution for monitoring and analysis of solder paste printing process.
• Measures Height, Volume, and Area of solder paste with the utmost accuracy
• Suitable for checking the CSP and fine pitch QFP paste locations.

Authentic measuring based on the real 3D image

To do analysis and monitoring role for solder paste printing process, the SPI 2500 embeds lots of useful tools and various measuring modes, those are auto and manual measuring modes. The machine’s scanning capability backed by precise laser sheet beam and scanning stage brings users the real 3 dimensional shape of a feature. On the basis of the true 3D image, the area and volume data as well as height data can be measured. Further the real 3D shape modeled on the OpenGL 3D window gives users a lot of information on printing process status, and also suggests guidelines how to stabilize the poor and hunting printing process.

The best quality of 3D image provided by this system is by virtue of the high precision laser sensor resulting from long years of PARMI’s R&D and field experience. This field proven high resolution sensor and the accurate moving table guarantee reliable measuring of pastes on the very tiny pads such as CSPs and fine pitch QFPs

Measuring Height, Area, and Volume

The measuring process is very simple. After placing a PCB on the working table, the just clicking the SCAN button of the live image mode automates scanning the area shown in the live image viewer, and makes up the 3D data. On finishing the scanning, the viewer’s mode changed to range image mode automatically. In the range image viewer, top view of the 3D shape is displayed and height values of all points are pseudo colored. Just some mouse selections on paste locations to be measured are everything necessary for measuring heights, areas, volumes of some solder pastes. On clicking the SPC button runs embedded SPC(Statistical Process Control) function. The measured data are written on the data sheet, and simultaneously the X-bar & Range charts and process capability chart are updated. The well designed graphical user interface makes the measuring operation be easy and comfortable. This whole measuring process only takes just tens of seconds.

Measuring Height, Area, and Volume

The measuring process is very simple. After placing a PCB on the working table, the just clicking the SCAN button of the live image mode automates scanning the area shown in the live image viewer, and makes up the 3D data. On finishing the scanning, the viewer’s mode changed to range image mode automatically. In the range image viewer, top view of the 3D shape is displayed and height values of all points are pseudo colored. Just some mouse selections on paste locations to be measured are everything necessary for measuring heights, areas, volumes of some solder pastes. On clicking the SPC button runs embedded SPC(Statistical Process Control) function. The measured data are written on the data sheet, and simultaneously the X-bar & Range charts and process capability chart are updated. The well designed graphical user interface makes the measuring operation be easy and comfortable. This whole measuring process only takes just tens of seconds.

3D modeling & Process Analysis

The 3D shape modeled on the 3D viewer gives user other meaningful information about the printing process. The shapes of solder pastes are tightly coupled to the screen printer parameters, such as the squeeze speed, squeeze pressure, snap off, etc. The 3D images on the viewer can be enlarged, translated, rotated to help operator’s further detailed analysis. And cross sectional profiles of a pad are displayed on the graph.