SolderStar PRO - Reflow Thermal Profiler

SolderStar PRO - Reflow Thermal Profiler Description:

The SolderStar PRO thermal profiling systems include our latest evolution of ultra-compact datalogger featuring the unique SolderStar ‘SmartLink’ connector system. The thermal profiler unit is docked into a protective heat shield and thermocouple adapter combination to provide the number of measurement channels required for the product profiling applications. Future upgrading or servicing is a simple and cost effective procedure, with only the Thermocouple Adapter needing to be changed to allow 6,9,12 or 16 Type-K measurement versions. The‘SmartLink’ concept results in a smaller thermal profiling instrument footprint, allowing the systems to easily pass though ovens with low tunnel heights or when narrow electronic assemblies are being produced. Additionally it provides a quick connection to a range of accessories for capture oft thermal profile and SPC information from reflow, wave/selective and vapour phase soldering processes. Temperature profile capture.