Benchtop solder paste thickness inspection BT-460

Benchtop solder paste thickness inspection BT-460 Description:

Solder paste thickness inspection BT-460 is mainly used to measure the thickness of solder layer on PCB. Its principle is that a very thin laser beam is emitted by the laser to illuminate the PCB at a certain Angle, and then the camera is used to observe the laser beam forming a thin line on PCB.Solder paste height and its bottom (PCB) will form a certain height difference, so that the laser line formed a certain break.The software calculates the height difference between the solder paste and the circuit board based on the laser break.