TECHNOMELT Adhesives - Low Pressure Molding Solutions
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TECHNOMELT Adhesives - Low Pressure Molding Solutions |
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TECHNOMELT Adhesives - Low Pressure Molding Solutions Description:
Henkel's Technomelt products are engineering hotmelt adhesives for industrial applications in various market segments.
Henkel's renowned TECHNOMELT low pressure molding solution is delivering superior sealing adhesion and excellent temperature and solvent resistance. The simplicity of these materials is their advantage: because the entire TECHNOMELT operation takes place at low pressure, cycle time is short and fine or fragile circuitry is not damaged, delivering measurable improvements over that of traditional potting or encapsulating processes. PCB and circuitry protection is essential in modern, challenging applications; and Henkel delivers manufacturers proven, reliable solutions and peace of mind.
What is TECHNOMELT?
An innovative technology to serve the increasing demands for circuit board protection in the electronics market. Its low pressure and high speeds are suitable for sensitive electronic components in manufacturing environments. The technology allows for unique design beyond the form/fit/function of traditional encapsulating materials.
Advantages:
- Complete watertight encapsulation
- Fast cycle time (15 to 45 seconds)
- Low capital equipment costs
- Safe, one-component, UL 94V-0 approved
- Low pressure and high speed molding for electronics encapsulation
- Zero waste
Macromelt…now Part of the Technomelt Brand
These thermoplastic hotmelts use extremely low pressure to effectively encapsulate even the most delicate circuitry. Macromelt cycle time is fast and processing temperatures are a modest 130 to 240°C, with in-use temperatures ranging from -40 to +140°C. As compared to traditional potting and encapsulating processes, Macromelt is superior, offering short cycle times, low-pressure molding and maximum yield with minimal material waste.
TECHNOMELT Circuit Board Protection Products: |
Color |
Performance Temperature |
Shore a Hardness |
Softening Point |
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|---|---|---|---|---|---|
Polyamide – High Temperature Resistance |
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TECHNOMELT PA 673 |
Moldable polyamide with good adhesion for higher temperature applications, such as in an automotive under-hood. |
Amber |
-40°C TO 140°C |
90 |
187°C ± 5°C |
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TECHNOMELT PA 678 |
Black |
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TECHNOMELT PA 682 |
Moldable polyamide for the most demanding high humidity applications, such as on the inside of an automobile tire. Formulated for very low water vapor transmission. |
Amber |
-40°C TO 140°C |
88 |
187°C ± 5°C |
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TECHNOMELT PA 687 |
Black |
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Polyamide: Adhesion to Plastics |
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TECHNOMELT PA 633 |
Moldable polyamide with service temperature up to 130°C, such as in an automotive firewall. |
Amber |
-40°C TO 130°C |
90 |
175°C ± 5°C |
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TECHNOMELT PA 638 |
Black |
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TECHNOMELT PA 652 |
Moldable polyamide, where excellent adhesion and cold temperature flexibility are important, such as in an automotive exterior. Also used extensively in white goods. |
Amber |
-40°C TO 100°C |
77 |
157°C ± 5°C |
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TECHNOMELT PA 657 |
Black |
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TECHNOMELT PA 6208 |
Moldable polyamide with excellent adhesion to tough substrates. Great flexibility offers incredible strain relief on cables and wires. Ideal for encapsulation of heat-producing components in appliance and consumer electronics, UL RTI 95°C. |
Amber |
-40°C TO 100°C |
78 |
155°C ± 5°C |
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TECHNOMELT PA 6208 BLACK |
Black |
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Polyamide: Increased Hardness |
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TECHNOMELT PA 341 |
High performance thermoplastic polyamide designed to offer safety blaze orange color for easy identification of components. Typically used to encapsulate high voltage modules. |
Safety Blaze Orange |
-25°C TO 125°C |
92 |
173°C ± 5°C |
|
TECHNOMELT PA 641 |
Moldable polyamide, where strength and hardness are needed, such as in memory sticks and computer connectors. |
Amber |
-40°C TO 130°C |
92 |
175°C ± 5°C |
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TECHNOMELT PA 646 |
Black |
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TECHNOMELT PA 648 |
UV stability and suitable for outdoor applications. |
Black |
-40°C TO 130°C |
93 |
175°C ± 5°C |
Polyolefin: Excellent Adhesion to Metals, Plastics, Tough Surfaces |
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TECHNOMELT AS 5373 |
Moldable polyolefin for demanding moisture and solvent resistance. Excellent adhesion to the most difficult substrates. Compatible with a secondary overmold with a harder polyamide. |
Opaque White |
-30°C TO 100°C |
55 |
130°C ± 5°C |
TECHNOMELT Adhesives - Low Pressure Molding Solutions was added in Dec 2013
TECHNOMELT Adhesives - Low Pressure Molding Solutions has been viewed 2944 times
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