SIPLACE CA Series - Chip Assembly and SMT Placement on a single platform

SIPLACE CA Series - Chip Assembly and SMT Placement on a single platform Description:

Chip assembly? Classic SMT placement? Our SIPLACE CA can do both.

The SIPLACE CA is the world's first placement platform that combines bare-die placement directly from the wafer and classic SMT placement in a single machine and a single production process. The benefit: For electronics manufacturers, this means fewer special processes and a much leaner production process for modern products involving flip-chips and die-attach.

The SIPLACE CA places up to 9,000 flip-chips or attaches up to 6,500 dies per hour with each of its SIPLACE SpeedStar heads. The components are supplied via special SIPLACE wafer systems (SWS) directly from wafers with diameters ranging from 4 to 12 inches. A Flip-Chip Unit (FCU), Die-Attach Unit (DAU) and Linear Dipping Unit (LDU) complete the equipment of the SIPLACE CA for flexible and highly accurate bare-die placement applications (±10 µm).

The gantries and heads of the SIPLACE CA which are not being used for bare-die placement can be supplied via component carts and X-feeders with passive components for the classic SMT placement process at speeds of up to 20,000 cph per head.

In short: The SIPLACE CA is the perfect solution for your state-of-the-art electronics production. Chip assembly and classic SMT placement converge on this platform for the first time.

Truly unique: How the SIPLACE CA earns this title

Chip assembly and SMT placement on a single platform

In the die-attach or flip-chip process, the SIPLACE CA places bare dies directly off the wafer. But it also offers the SMT placement features you already know from the SIPLACE X-Series. The SIPLACE CA can be used for bare-die or SMT placement exclusively or handle both in a single-pass operation.

Everything you need for die assembly

Many special developments optimize the deployment options for the SIPLACE CA. The horizontal SIPLACE wafer system is suitable for wafers ranging from 4 to 12 inches and changes wafers automatically.  Multi-die capabilities, programmable die cutting speed and hoop ring handling are additional features. The Linear Dip Unit, Die Attach Unit and Flip Chip Unit complete the SIPLACE CA and the placement platform for bare-dies.