High reliability Copper Clad Laminate

High reliability Copper Clad Laminate Description:

Thin core & Prepreg for HDI/high layer count for print circuit board(PCB) fabricator High Tg (> 170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion (< 2.8% from 50 �C 260oC) Excellent thermal performance, High heat resistance demonstrated by T-260, T-288 and T-300 T-260 > 60 min. T-288 > 20 min. T-300 > 10 min. Lead Free process compatible, 6x 260 oC reflow + 6x 288 oC solder float,10 sec no delamination inspected by micro-section Over 15 cycles by thermal stress 288 oC and 310 oC, 10 sec solder float. Limited CTE for high through-hole reliability Anti-CAF > 1000 hours Low cost version Prepreg: 7628, 2116, 1080, 1501, 3313, 106