Design and Manufacturing with SMT Surface Mount Technology
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Design and Manufacturing with SMT Surface Mount Technology Description:
The objective of this course is to identify the technical issues in Through hole, SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products. The course material is based on Mr. Prasad's textbook Surface Mount Technology: Principles and Practice, 2nd Edition (767 Pages). There are three classes in this one class.- The first part provides an overview of SMT and advanced packaging technologies.
- Part 2 deals with the details of Design for Manufacturing, test and repair of SMT and BGA and Fine Pitch components.
- And the final part provides an in-depth details of all the SMT manufacturing processes including Selective Soldering, Lead free soldering, inspection, Quality Control and repair.
Design and Manufacturing with SMT Surface Mount Technology was added in Jun 2009
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