AW-901eR AW-903eR Plasma Etcher Equipment

AW-901eR AW-903eR Plasma Etcher Equipment Description:

sales@allwin21.com

The AW-901eR & AW-903eR single-wafer dry etchers are automated tools designed as a flexible 13.56MHz RF Parallel Plate plasma etching systems for high-volume wafer fabrication. AW-901eR & AW-903eR are in direct response to manufacturer’s concerns for wafer breakage, Uniformity, Uptime, Reliability, and Production-Proven technology. 

Key Features:

1.           Production-proven plasma etching system.
2.           Up to 3%-5% Uniformity.
3.           Frontside and backside isotropic and anisotropic etch.
4.           Process Temperature: 6-65°C .
5.           75mm-150mm wafer capability.
6.           Integrated solid robotic wafer handling. Single wafer process.
7.           Fixed cassette station and wafer aligner/cooling station.
8.           Can handle 50um thickness wafer.
9.           PC controller with Advanced Allwin21 Software.
10.           Endpoint detection with Allwin21 SLOPE technology. (Optional)
11.           Up to 4 gas lines with MFC’s.
12.           MKS 13.56 MHz RF Air-Cooled Generator 300W, 600W, or 1000W.
13.           Pressure control with UPC. Throttle valve is optional.
14.           Touch screen GUI.
15.           EMO, Interlocks, and Watchdog function.
16.           GEM/SECS II (Optional)
17.           Small Footprint
18.           Made in U.S.A.

Specifications:

1. Up to 6 inch Capability
2. Throughput: 30-60 WPH, Process Dependent
3. Temperature: 6-65ºC (±2 ºC) capability
4. Gas Lines: 4 gas lines with MFCs.
5. Etcher Rate: AW-901eR: 0-8000A/minute; AW-903eR: 0-4000A/minute, Process Dependent
6. Uniformity: Up to ±3%, Process Dependent
7. Particulate: <0.05 /cm2 (0.03um or greater)
8. Selectivity: 901eR: 2-20:1 ;    AW-903eR: 2-20:1, Process Dependent
9. MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better. 95% uptime
10. * Contact Allwin21 sales for other applications and specifications

sales@allwin21.com