FINEPLACER® core^plus - Medium Size BGA Rework Station

FINEPLACER® core^plus - Medium Size BGA Rework Station Description:

Cost Effective Rework of Medium Size Boards

The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price.  The system offers proven rework technology for a wide spectrum of SMD components, ranging in size from 0201 to 90 mm x 90 mm.

This compact rework station is based on Finetech’s proven technology integrating the complete rework cycle into an efficient design, without diminishing functionality. The system is at home in production environments where process reproducibility is crucial.

The large area under-board heater for PCBs supports board sizes up to 400 mm x 310 mm

Cost-efficient Hot Air Rework Solution

Like all of Finetech’s rework systems, FINEPLACER® core+ is based on superior and proven hot air soldering technology. In order to ensure a very gentle heat transfer according to IPC/JEDEC standards, the thermal management provides harmonized interaction of top and bottom heating. With respect to components and board size and following Finetech’s mission of engineering environmentally friendly machines, only the necessary heat is being conveyed. For optimized soldering results, FINEPLACER® core+ supports the use of nitrogen and other process gases.

Thanks to its compact design, the FINEPLACER® core+ doesn’t compromise with respect to its functional range either. Quite on the contrary, it efficiently supports all functionalities of a future-proof rework system. The full rework cycle can be integrated into the machine, including de-soldering and soldering, component removal and site cleaning, re-balling (array), paste printing (component or board), paste dipping and fluxing.

Finetech’s in-situ process observation camera allows the ability to view the reflow process at almost any angle.

Highlights:

• Components from 0.25 mm x 0.25 mm up to 90 x 90 mm*
• Proven thermal management solution with hot air top and bottom heating
• Automated processes with force measurement
• Compact, integrated machine design
• Cost efficient soldering tools, compatible with all FINEPLACER® rework station
• Placement accuracy better than 25 µm

Features

• Automated soldering processes
• Patented vision alignment system with fixed beam splitter
• Component Profile Library for Tin/Lead and Lead Free applications.
• Intelligent thermal management via Windows based software

Benefits

• User independent process operation
• Fixed prism needs no regular calibration
• The complete rework cycle within one cost-effective system solution
• Reproducible placement accuracy
• Coordinated control of all process parameters: temperature, gas flow, soak time, process environment
• Immediate visual feedback reduces process development time
• Repeatable profiles from machine to machine

Applications

• Rework of:
  • BGA, µBGA/CSP, QFN, PoP, QFP, PGA,
  • Small passives down to 0201
  • RF shields, RF frames
  • Connectors, sockets
  • Sub assemblies, daughter boards
• Through hole technology pin in paste
• Reworkable underfill, conformal coating

FINEPLACER® systems

The modular FINEPLACER® systems offer maximum process flexibility in many different connection technologies. They include a wide variety of soldering and bonding technologies, as well as ultrasonic and thermal compression bonding. FINEPLACER® systems are used especially in R&D, prototype building and small series production.