GF-B-HT Reflow Ovens

GF-B-HT Reflow Ovens Description:

Cost-effective batch reflow oven utilizing forced air convection heating technology with individual time and temperature controls makes profile set up quick and easy. The GF-B-HT is a high temperature model capable of lead and lead-free soldering. 

This unique shuffle system enables a higher throughput than standard batch ovens. Both sides of the oven have a cooling station. While one board is being processed, another board can be cooled and off-loaded, then a third board can be loaded and shuttled into the chamber for reflow.

• Large to window allows the operator to see the board throughout the entire reflow process
• Unique shuttle system enables higher throughput than standard batch ovens
• All stainless steel interior construction provides for years of useful life
• Nitrogen gas inerting option available
• Maximum board size is 12" x 12" (305mm x 305mm)
• Compatible with Lead and Lead-free soldering applications