aSPIre3 3D In-line Solder Paste Inspection System

aSPIre3 3D In-line Solder Paste Inspection System Description:

Koh Young Technology’s new product aSPIre 3D In-line Solder Paste Inspection System adds more value to your production. Keeping with high speed SMT lines, aSPIre system helps maximizing productivity and ensures no compromise is made between speed and accurate 100% 3D measurement capability as well as unrivalled measurement performance of <10% Gage R&R on microchip deposits.

Accuracy:

• The 100% 3D Paste Measurement based on the patented
• Shadow-Free measurement technology

Speed:

• Industry-leading high speed 3D measurement

Intelligence:

• Intelligent user interface and SPC tool for process optimization

Reliability:

• Unrivalled measurement performance

Additional aSPIre 3D In-line Solder Paste Inspection System Features:

• The next generation GUI and SPC package included in the system
• Less than 10 min. programming for a complete inspection file
• No fine tuning or inspection parameter setting necessary
• Comprehensive statistical analysis tool enables accurate process feedback

Inspection Items:

• Volume, Area, Height, Offset, Bridging, Shape Deformity, Coplanarity