KY8030-2 3D Solder Paste Inspection System
Company Information:
Name: |
KY8030-2 3D Solder Paste Inspection System |
Category: |
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Offered by: |
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KY8030-2 3D Solder Paste Inspection System Description:
Dual Projection 3D In-Line SPI For High-Volume, Low-Mix Production
The new KY8030-2 delivers 2x faster inspection without compromising performance and accuracy. Using patented dual projection, the system eliminates the critical Shadow problem that all 3D SPI systems can be vulnerable to. Easy UI and SPC Plus are included in the system package in order to help users achieve faster & easier printer process optimization
Key Features:
- Solution to shadow problem using patented dual projection Moiré technology
- Industry best inspection speed with guaranteed measurement accuracy
- Easy UI & SPC Plus included to help printing process optimization
Inspection Items: Volume, Area, Height, Offset, Bridging, Shape Deformity, Coplanarity
Inspection Speed:
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Resolution |
15um |
20um |
25um |
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Inspection time(per FOV) |
0.47sec |
0.47sec |
0.47sec |
Max. PCB size:
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Machine Size |
M |
L |
XL |
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Max |
330 x 250 mm |
510 x 510 mm |
810 x 610 mm |
Min. PCB size: 50X50mm
KY8030-2 3D Solder Paste Inspection System was added in Jan 2013
KY8030-2 3D Solder Paste Inspection System has been viewed 4764 times
