KY8030-3 3D Solder Paste Inspection System
Company Information:
Name: |
KY8030-3 3D Solder Paste Inspection System |
Category: |
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Offered by: |
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KY8030-3 3D Solder Paste Inspection System Description:
High-speed, High Performance 3D In-Line SPI with Dual Projection
The new KY8030-3 delivers 3x faster inspection without compromising performance and accuracy. Using patented dual projection, the system eliminates the critical Shadow problem that all 3D SPI systems can be vulnerable to. Additionally, the new KY8030-3 has solved the PCB Warp problem that seriously impacts inspection accuracy and reliability of result.
Key Features:
- Best Inspection Speed without Compromising Accuracy
- Field Proven Process Optimization
- Patented Shadow Free Moiré Technology
- Perfect PCB Warp Compensation
Inspection Items: Volume, Area, Height, Offset, Bridging, Shape Deformity, Coplanarity
Inspection Speed:
|
Resolution |
10um |
15um |
20um |
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Inspection time(per FOV) |
0.30sec |
0.31sec |
0.33sec |
Max. PCB size:
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Machine Size |
M |
L |
XL |
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Max |
330 x 250 mm |
510 x 510 mm |
810 x 610 mm |
Min. PCB size: 50X50mm
KY8030-3 3D Solder Paste Inspection System was added in Jan 2013
KY8030-3 3D Solder Paste Inspection System has been viewed 4343 times
