Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder Description:

The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specialized bond heads that can be changed out in minutes. A robust, clean design with the largest work area in the industry, low maintenance requirements and user-friendly software and service support functions are integrated into the Bondjet BJ931, along with Hesse Mechatronics’ industry-leading PiQC™ process monitoring system.

Bondjet BJ931 Key Features

A solid, high-speed, dual-head wedge bonder platform

• Highest UPH on the market due to linear motors for all bonder axes
• Linear motor-driven indexing system (<100 ms indexing time for typical TO 220 devices)
• A clean design provides easy access to all machine components
• A stiff body design and sophisticated vibration damping make it the most robust wedge bonder in the industry
• Rapid image capture with new digital image processing and flash light illumination

Central wedge bonder control system

• A central 23” touch panel is used to monitor and control the bonder and indexing system
• A user-friendly calibration wizard supports automatic update of calibration data at bond head change on all available bond heads
• Easy connectivity to standard and custom MES (Manufacturing execution systems)
• Gigabit Ethernet TCP/IP connection for the fastest possible manufacturing floor connectivity
• Full USB support for connecting storage devices
• Remote maintenance tools via Ethernet for easy access to data from anywhere

Interchangeable bond heads

• The Bondjet BJ931 supports thin and heavy wire bond heads as well as ribbon bond heads for aluminum, copper, gold wire and ribbon
• An intelligent bond head connecting system with integrated memory stores all calibration data and enables bond head replacement in two minutes
• Wire clamp for loop shape control and non-destructive pull test is standard on all heavy wire bond heads
• The new bond head connecting system allows a system conversion – for example from wire to ribbon – in a very short time

Process Integrated Quality Control System - PiQC™

• The integrated PiQC system provides quality control for 100% of bonds on every type of application – from matrix lead frames to stitch bonds to simple source destination bonds – without a time delay. All data can be stored and displayed on the bonder screen and   analyzed with additional software.
• The standard PiQC bond process control system monitors bond friction deformation, current and frequency signal with user-defined quality range limits. All data can be stored for later evaluation
• Up to eight additional in-line non-destructive pull testers are available on the integrated indexing system
• Integrated non-destructive pull test on heavy wire bond heads can be used in combination and controlled by PiQC