NC 256
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NC 256 |
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NC 256 Description:
YINCAE is excited to announce that we have successfully developed a new No Clean Flux product - NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package in package), particularly for lead free applications, but also for flip chip, CSP, BGA, and other advanced components attachment to eliminate cleaning process.
If you are interested in NC 256 please email us at info@yincae.com or call us at (518) 452-2880
NC 256 was added in Aug 2020
NC 256 has been viewed 96 times
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