SMT 158 Capillary Underfill

SMT 158 Capillary Underfill Description:

Yincae’s SMT 158 Capillary Underfill is a combination of capillary flow and no-flow underfills, rapid curing, fast flowing and easy reworking liquid epoxy that can be used as an underfill for chip scale packages, ball grid array devices, PoP (package-on-package) and land grid arrays as well as some flip chip applications. Additionally, SMT 158 is suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multichip modules.

The underfill was designed for high-volume production environments where process speed and mechanical shock are key concerns. The material is dispensed easily, minimizes induced stresses, and provides outstanding reliability performance (e.g. temperature cycling performance) and excellent mechanical resistance.

This material is easily dispensed, minimizes induced stresses and provides outstanding reliability performance and excellent mechanical resistance.

We offer a broad range of colors, filler concentrations, and particle sizes for this series to cater to our customer needs and requirements.