BP 256 Ball Attach Adhesive
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BP 256 Ball Attach Adhesive |
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BP 256 Ball Attach Adhesive Description:
BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During the reflow process, this polymer adhesive removes metal oxide and allows solder joint to be formed; meanwhile, a 3-D polymer network starts to form and encapsulates individual solder bump with enhancing the joint to eliminate some drawbacks of later underfilling (large CTE above Tg, trouble process control). The performance of drop test has been improved by two orders of magnitude compared with that with the use of solder paste. The polymer network can be removed using methyl ethyl ketone (MEK) or heating.
- Eliminates Cleaning Process for Ball Bumping
- Enhances Solder Joint Strength 5-10X
- Eliminates Underfill
- 100% Reworkable
BP 256 Ball Attach Adhesive was added in Nov 2016
BP 256 Ball Attach Adhesive has been viewed 449 times
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