SMT Equipment

NC-559-ASM No-Clean Solder Paste

Company Information:

Manufacturer of materials for the electronics assembly marketplace. Our RoHS-compliant products include solder pastes, fluxes, solder powder, core wire and bar solder and process support products.

Deep River, Connecticut, USA

Manufacturer

  • Phone 860-526-8300
  • Fax 860-526-8243

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Company Postings:

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NC-559-ASM No-Clean Solder Paste

NC-559-ASM No-Clean Solder Paste

Name:

NC-559-ASM No-Clean Solder Paste

Category:

Solder Materials

Offered by:

AMTECH

NC-559-ASM No-Clean Solder Paste Description:

High Activity, Completely Odorless, No-clean Solder Paste

  • Exceptional print definition
  • Long stencil life
  • Wide process window
  • Excellent wetting compatibility on most board finishes
  • Low voiding
  • Compatible with enclosed printing heads
  • Low residue

Alloys

AMTECH manufactures a low-oxide, spherical and uniformly sized powder. NC-559 is available in the following alloys: 63Sn/37Pb, 62Sn/36Pb/2Ag, 60Sn/40Pb, 43Sn/43Pb/14Bi.

Available Packaging

The following packaging options are available for stencil printing and dispensing applications:

  • 250g and 500g jars; 250g and 700g cartridges
  • 750g ProFlow® cassettes; 35g and 100g syringes
  • 2,500g FreshMix® Kits.

Stencil Life:

  • 6-8 hrs. @ 30–45% RH & 22–25°C
  • ~4 hrs. @ 45–70% RH & 22–25°C

Viscosity

  • Printing applications: 700 to 800Kcps +/-10%
  • Dispensing applications: 425Kcps +/-10%
  • Tested according to IPC-TM-650

Tack Value

  • Typical tackiness: 35g force

Printing

The print definition of NC-559 is ideal for fine pitch applications. The stencil life of this no-clean product virtually eliminates waste of solder paste. Consult the powder distribution chart to determine your mesh size requirements.

Printer Operation

The following are general guidelines for stencil printer optimization with NC-559. Some adjustments may be necessary based on your process requirements.

  • Print Speed: 25–100mm/sec
  • Squeegee Pressure: 0.2–0.7kg/inch of blade
  • Under Stencil Wipe: Once every 10–25 prints or as necessary

Stencil Cleaning:

Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using 99% isopropyl alcohol (IPA) works well.

Storage and Handling Procedures:

Refrigerated storage at 42–47°F will prolong the solder paste shelf life to no less than 6 months. Syringes & cartridges should be stored vertically with the dispensing tip down. Solder paste should be allowed to reach ambient temperature naturally, prior to use (about 6-8 hours). NEVER FREEZE SOLDER PASTE.

NC-559-ASM No-Clean Solder Paste was added in Jan 2013

NC-559-ASM No-Clean Solder Paste has been viewed 823 times

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