3D Master 3000 neo / wide - Table Top SPI System

3D Master 3000 neo / wide - Table Top SPI System Description:

Description

This device is designed to measure the shapes of 3-dimensional surfaces of objects that measure from dozen microns to a few millimeters, and is commonly used for measuring solder paste samples spread over PCBs automatically and 3-dimensionally, and testing their conformity. For SMT process management, this device is being recognized as the most cost-effective equipment for setting up process conditions for screen printers. In addition, this device can be used for measuring the thickness of small electronic components, the thickness of the pads and pattern on bare PCB. Automatic inspection and measurement can be achieved using the automatic X-Y scanning covering wide ranges.

Highlights

• The motorized automatic inspection covers the entire region of a PCB, which measures a maximum of 510 x 460 mm
• 3D measurement is supported, in addition to the measurement of 2D length, areas, etc.
• Increased user convenience by the use of color cameras
• Measurements are analyzed by the diverse and useful SPC tools

Measurement item: Height, Volume, Length, Width, Area, 3D Shape
Measurement method: Line Laser Triangulation
Optical system: Color CCD Camera (FOV : 3.2X2.4 mm)
Measurement speed: Max. 60 profiles
Measurement range(Z): Height : 500 μm
Resolution: Height : 0.5μm
Repeatability (3б): Height : below 1.2μm , Volume : below 1%
Measurement range(XY): 300(X) X 300(Y) mm (neo) / 510(X) X 460(Y) mm (wide)
Object loading & unloading: Manual
Key functions;
- Automatic 3D measurement & inspection
- 2D dimension check
- 3D Cross-section view & analysis
SPC software;
- Cp, Cpk, Sigma, Histogram
- Chart : X bar R&S, Trend, Scatter, C.P
- Data export to Excel & Text
Power;
AC 110 / 220V, 50/60Hz
Dimensions and weight;
neo : 650(W) X737(D) X354(H)mm / 60Kg
wide : 860(W) X1,030(D) X390(H)mm / 90Kg