X3 Inline X-Ray Inspection System / 3D & Transmission

X3 Inline X-Ray Inspection System / 3D & Transmission Description:

Inline x-ray inspection system for combined 3D and transmission x-ray analysis of double-sided boards with high package density. Universal standard system based on the MatriX X2.5 AXI system motion concept with 360º angle shot coverage. A new 3D reconstruction software features the generation of detailed, high resolution slice images.

The X3 provides a flexible approach to inspecting solder joints on a double-sided board. Through the smart CAD Compiler, the board is segmented into a inspection strategy automated based on non-overlapping and over-lapping regions. In non-overlapping regions, 2D transmission views are taken. In overlapping areas, either the patented Slice Filter Technology (SFT) can be used to separate the overlapping components or the state-of-the-art 3D reconstruction technique called 3D-SART. 3D-SART allows for slice image sets through the entire assembly top to bottom with the highest resolution available in the market.

Key features

• Flexible inspection techniques (2D, 2.5D, 3D) based on board topology
• Off-Axis imaging (2.5D) specific for BGA devices to check for Head-In-Pillow (HIP) or Head-on-Pillow (HOP) and Barrel-Fill detection of Pin-in-Paste / THT connectors
• 3D Simultaneous Algebraic Reconstruction Technique (3D-SART) which produces industry leading slice image resolution

X-ray system features

• 130kV high resolution x-ray tube
• 2k x 2k digital flatpanel detector on x-y motion system
• 5-axis programmable motion system Algebraic reconstruction algorithm for 3D analysis (SART)
• MIPS inspection platform for off-line programming, analyzing and verification. Including a modular test algorithm library for solder joint inspection

Applications

• Double sided boards with high packing density and hidden solder joints
• Power components with heat sinks
• All standard SMD's and THT/PTH components
• Specific BGA and QFN applications
• MCM Modules
• Cooling plates/heatsink void inspection