X2.5 Automated In-line X-ray Inspection (Transmission, 3D-SFT, Off-Axis)

X2.5 Automated In-line X-ray Inspection (Transmission, 3D-SFT, Off-Axis) Description:

Automated inspection system designed for sophisticated high-speed inspection in SMT production. Transmission X-ray Technology with patented Slice-Filter-Technique (SFT) and Off-Axis Technology present a reliable solution for the in-line inspection of double-sided PCB assemblies. The X2.5 movable detector axes allow high-speed off-axis image acquisition from different angles and directions with maximum image quality and resolution.

The X2.5 accurately identifies Head-in-Pillow (HIP) defects

Using Off-Axis Imaging (2.5D), the X2.5 together with our industry leading off-axis algorithms allows for feature measurement of BGA's to extract unique image signatures only available by off-axis images to detect Head-in-Pillow (HIP) defects with the highest detection rate.

The X2.5 detects Pin-in-Paste / THT connector Barrel-fill

Using off-axis (2.5D) imaging technology together with an advanced THT inspection library, the X2.5 can measure and compute barrel fill through the entire barrel as well as both the top side and bottom side of the connector independently. 

X-ray system features

• Microfocus X-RAY tube (sealed) 130kV/40W wide beam
• 5-axes programmable motion system with linear drive sample table for high speed inspection mode
• Digital CMOS flatpanel detector setup on u/v motion system (14 bit digital output, 2k x 2k)
• MIPS inspection platform for off-line programming, analyzing and verification. Including a modular test algorithm library for solder joint inspection

Applications

• All standard SMD`s and THT/PTH components
• Specific BGA and QFN algorithm
• PTH/THT barrel fill measurement
• Cooling plates/heatsink void inspection