Lead-Free Hot Air Reflow Ovens

Lead-Free Hot Air Reflow Ovens Description:

Easy-operation!
Save energy!
Good Price !
Environment friendly!

Windows XP operation software with Chinese and English alternative. Whole system under integration control can analyze and display the failure. All production data can be saved completely and analyzed.
PC& Siemens PLC controlling unit with stable performance; high precision of profile repetition can avoid product loss attributed by abnormal running of the computer.
Unique design of the thermal convection of the heating zones from 4 sides provides high heat efficiency;  
T between 2 joins zones can avoid the temperature interference; It can shorten the temperature difference between big-size and small component and meet the soldering demand of complex PCB.
Forced air cooling or water cooling chiller with efficient cooling speed suits all different kinds of lead-free soldering paste.
Low power consumption (8-10 KWH/hour) to save the manufacture cost
With complete alarms system ,failures can be listed on the PC interface
  Operation System 
Basing on Windows XP  operation software ,both English and Chinese versions are available.
Many functions can be achieved automatically on PC.


Control System  
Siemens PLC+ Industrial PC ensures precise controlling unit and stabilized performance.


  Air Cooling System 
Forcible air cooling with low temperature complies with the demand of lead-free process.


Modularized Heaters  
Modularized heaters can be removed for maintenance conveniently.

UPS Power 
UPS provide backup power of the machine, and PCB will not be damaged while breaking-off or overheating.

Temperature Control System 
High temperature uniformity inside the chamber provides efficient heat utilization and conduction.