IR2005 IR Infrared BGA Rework System
Company Information:
Name: |
IR2005 IR Infrared BGA Rework System |
Category: |
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Offered by: |
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IR2005 IR Infrared BGA Rework System Description:
- No need of nozzles, no airflow during re-flow process.
- Use non-contact infrared temperature sensor to measure temperature real-timely, and achieve closed loop control of temperature during rework process, especially suitable for lead free process.
- By reflecting foil to reduce thermal transmission to adjacent components.
- Camera of BGA Rework System can be used to monitor the re-flow process.
- No airflow during the process of BGA re-balling, and the success ratio of BGA re-balling can almost be up to 100%.
Specifications:
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General power |
1600Watt(max) |
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Power of bottom heater |
400W*2=800Watt(Dark infrared heating plate) |
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Power of top heater |
180W*4=720Watt (Infrared heating tube, wavelength about 2-8μm) |
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Size of top heater |
60*60mm |
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Size of bottom heater |
135*250mm |
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Range of top heater |
20-60mm(X, Y direction both adjustable) |
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Vacuum pump |
12V/300mA, 0.05Mpa(max) |
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Top cooling fan |
12V/300mA, 15CFM |
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Laser alignment tube |
3V/30mA |
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Movable motor |
24V DC/100mA |
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Movable arm range |
93mm |
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Max PCB size |
300mm*300mm |
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LCD window |
65.7*23.5mm 16*2 characters |
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Soldering power |
60Watt |
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Communication |
RS-232C(connect with PC) |
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Infrared temperature sensor |
0-300℃(Testing range) |
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External K-type sensor |
Optional |
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Weight |
About 13kg |
IR2005 IR Infrared BGA Rework System was added in Aug 2015
IR2005 IR Infrared BGA Rework System has been viewed 313 times
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