Pulsed Heat HBR/HSC/ACF Bonding System

Company Information:

Plastlist is a professional industrial solution provider, who is in engaged in design, manufacturing, equipment agency, material & accessories supply.

Taichung, Taiwan

Consultant / Service Provider, Manufacturer

886-423-260-632

See Supplier Website »

Company Postings:

(23) SMT parts, accessories & PCB supplies items

(161) products in the catalog

Name:	Pulsed Heat HBR/HSC/ACF Bonding System
Category:	Soldering Robots
Offered by:	Plastlist Group

Pulsed Heat HBR/HSC/ACF Bonding System Description:

Pulsed Heat HBR/HSC/ACF Bonding System

Model No.: HB213/203

Features:

Realtime temperature and force profile display on the LCD touch screen.
Titanium alloy thermode ensure uniform temperature distribution, fast heating and longest service life.
Password protection for process and system parameters.
Level mechanism for components co-planarity adjustment.
English / Simplify Chinese / Traditional Chinese user interface display.

Options:

Tape Feeding System (TFS1) for holding silicon or Polyimid (Kapton) tape.
Colour (CC19) alignment module for TAB/flex to PCB/LCD.
Thermal Profiling Unit (TPU1); additional thermocouples for temperature profile monitoring.

SYSTEM SPECIFICATIONS
Dimensions	630 mm x 520 mm x 500 mm
Weight (without fixtures)	60 Kg
Power consumption	220V / 60Hz or 110V / 50Hz, 2KVA (Factory preset)
Air supply	4 to 6 Kg/cm2
Maximum fixture height	48 mm
Fixture assembly baseplate	150 mm x 150 mm ( 2 sets)
Starting operation method	Two hand control
Turntable actuation	Pneumatic (PBS213); Manual (PBS203)
Vacuum for components holding	2 sets; built-in
Password	6 digits (2-level)
THERMODE SPECIFICATIONS
Force range	20 N to 500 N
Force accuracy	±2 N
Actuation type	Pneumatic
Thermode stroke	50 mm maximum
Thermode length	100 mm maximum
PULSED HEAT CONTROL SPECIFICATIONS
Heating method	Pulsed heating, high speed PID control
Temperature range preheat	50 to 500 ℃(1 degree increment)
Temperature range heat	50 to 500 ℃ (1 degree increment)
Time period preheat	1 to 60 seconds (1 second increment)
Time period heat	1 to 60 seconds (1 second increment)
Temperature accuracy	±2℃
Programmable heat profile	3 programs, non-volatile
Thermocouple	K type
Communication port	RS-232C