Mini size wave soldering machine/DIP components soldering machine TB680

Mini size wave soldering machine/DIP components soldering machine TB680 Description:

Mini size wave soldering machine/DIP components soldering machine TB680

Mini size wave soldering machine/DIP components soldering machine TB680

ⅠSummary

Desk wave soldering machine TB680 has been developed by Torch, It is the first equipment in small type wave soldering field. TB680 is suitable for research center, war industry, middle- and small-sized corporation, small private corporation and other electronic production companies. It is a desk-type, taking up small room, with multi-functions, energy-saving and high efficiency. The operation is easy and especially suitable for small and middle batch production.

Ⅱ Main technology parameters

max power:                          3KW

pot capacity:                         37Kg tin

max PCB size:                        200X270mm (max)

temperature range:                200-300°C  LED display

preheating temperature:                    70-90°C

height range of wave crest:         5-12mm

Melting time:                       80min

flux spray :                       froth

power supply:                   220V±1%V  AC  single phase 50Hz

(please connect power to the ground)

transmission speed:                    0.5-3m/min

dimension :                          850X600X330mm

net weight:                              48Kg

Function

There are 6 parts: flux, preheating, soldering, electrical controlling, exhaust unit and convection unit.

1. Flux

Flux parts are made of air pump, air tube, pin valve, filter, froth tube and flux box.

Flux

There is flux belt on the froth tube, PCB whose side has chips is on the top and touch flux, the side will has flux film.

preheating

It is made by melt board with resistor to provide heat for PCB.

soldering

It is made by tin pot, heating board, wave pump and tin.

1 tin pot

2 clapboard

3 nozzle

4 regulator

5 wave pump

6 channel

Soldering

Figure 3: The solder will be divided into upper and lower levels by clapboard, the lower for the high-pressure layer, the upper layer for the low-pressure layer, liquid solder will be into high pressure layer driven by wave pump, the solder in the high pressure layer rotate and then pass regulator, it will overflow from the nozzle, the wave crest form and then fall into low pressure layer because of gravity

4 electrical controlling

With modular structure, transmission speed, solder temperature, preheating time and others can be adjusted and controlled. Working principle is shown in Figure 4.

Figure 4 electrical controlling

1. exhaust unit

It is made of cover, air fan, air cover and air tube. All exhaust generated in soldering will be eliminated.

1. convection unit

It is made of chain, rail, drive and pallet. PCB will be sent in flux unit, preheating unit and soldering unit by convection unit.

view:http://preview.alibaba.com/product/1706226395-200609071/Mini_size_wave_soldering_machine_DIP_components_soldering_machine_TB680.html

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