SMT Equipment

ultra thin BGA printed circuit boards factory ,for 0.1-0.4mm(2layer or multilayer) with LDI/Mekki machines

Company Information:

Horexs (Hubei)Electronic Limited/HongRuiXing

IC substrate Manufacturer akenzhang@horexspcb.com BGA/FCCSP/Bumping/Sip/CSP/Memory/Module substrate

huizhou city,

Manufacturer

  • Phone 13825288578
  • Fax 13825288578

Horexs (Hubei)Electronic Limited/HongRuiXing website

Company Postings:

(28) products in the catalog

ultra thin BGA printed circuit boards factory ,for 0.1-0.4mm(2layer or multilayer) with LDI/Mekki machines

ultra thin BGA printed circuit boards factory ,for 0.1-0.4mm(2layer or multilayer) with LDI/Mekki machines

Name:

ultra thin BGA printed circuit boards factory ,for 0.1-0.4mm(2layer or multilayer) with LDI/Mekki machines

Category:

Fabrication Services

Offered by:

Horexs (Hubei)Electronic Limited/HongRuiXing

ultra thin BGA printed circuit boards factory ,for 0.1-0.4mm(2layer or multilayer) with LDI/Mekki machines Description:

Horexs (Boluo HongRuiXing Electronic Limited)is thin FR4 PCB factory(0.1-0.4mm FR4 pcb/2L&multilayer), factory is located in huizhou city China,nearby Shenzhen city. Factory area of Horexs is more than 10000 square meters, which invested 30 million USD, has more than 200 employees, more than 30% technical engineers,And machines was imported from Japan, the monthly production capacity is more than 20000 square meters, whole process of thin FR4 PCB factory. 

Horexs's PCB mainly use for the products are: USB,IC Substrate,digital cemera card,TF card,MEMS,5G electronics, Memory Card,SD card,Mini LED,UDP, SIM card, CMOS, fingerprint identification card, antenna board,Bank card,IC card, etc.

ultra thin BGA printed circuit boards factory ,for 0.1-0.4mm(2layer or multilayer) with LDI/Mekki machines was added in Oct 2020

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