Newest BGA/LED repairing machine ZM-R720A for small component chip soldering and desoldering
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Newest BGA/LED repairing machine ZM-R720A for small component chip soldering and desoldering |
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Newest BGA/LED repairing machine ZM-R720A for small component chip soldering and desoldering Description:
Newest BGA/LED repairing machine ZM-R720A for small component chip soldering and desoldering
We provide customized SMT inspection and repairing solution , Contact me for more information: whatsapp/wechat/viber:0086-134 3448 1030
Zhuomao new ZM-R720 BGA/ LED rework station is a high performance automatic optical BGA rework station with HD camera Optical alignment system , CCD color optical vision system.
With automatic alignment system and auto focus alignment lens, it is especially suit for high precision motherboard rework.
Widely repairing application:
Laptops, PCs, TVs, printers, control boards, tablets, macbook, imac, PC, cell phone etc..
Mobile phone motherboard
Iphone, Samsung, Huawei, LG, Xiaomi etc.
Macbook, laptop, PC logic board
Apple, Lenovo, Asus, Thinkpad, Sony, HP, Dell, Acer, Samsung, Hasee
Game console logic board
XBOX360, PS2, PS3, PS4
TV logic board
SAMSUNG,LGE, Hisense, TCL,SKYWORTH, SONY, AOC/TP Vision, Vizio, Haier, CHANGHONG, Panasonic,Sharp, KONKA
LED display module
Advertising indoor, outdoor, sports, signs led display module
Main features:
1. Widely used for BGA LED mini chipset repairing.
2. Automatically Soldering, Desoldering, Romoving and Mounting the BGA Chip
3. HD Optical alignment system for precisely mounting BGA and components
4. Laser Positioning function for fast positioning the BGA Chip and motherboard
5. CCD color optical vision system, to enlarge the images up to maximum 230 times
6. Components mounting accuracy within 0.01mm , Repair success rate 99.9%
7. Rework micro BGA, VGA, CCGA, QFN, CSP, LGA, SMD, etc
8. Precise Temperature Control, accuracy within 2℃
9. Superior Safety Functions, with Emergency protection
10. Mounting head built-in pressure testing device, to protect the PCB
High resolution optical alignment system
Can reach accurate rework for BGA/ LED components positioning, ensure precise mounting.
Supports multiple languages, Chinese, English, Italian, German, etc.
Specification
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Specification for new ZM-R720 BGA rework station |
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Total Power |
Max 5300W |
Power |
AC 220V±10% 50/60 Hz |
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Top heater power |
1200W |
Bottom heater power |
1200W |
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IR power |
3000W |
Hot air temp |
400℃ (Max) |
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Preheating temp |
400℃ (Max) |
Positioning |
V-groove +laser positioning+ universal fixture |
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PCB size |
Max 410×370 mm |
Preheating size |
370mm×270mm |
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Chip type |
BGA, QGN, CSP, POP, QFN, Micro SMD, LED lamp beads |
Chip size |
Max 80×80mm Min 2×2 mm |
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Dimensions |
L640×W630×H900 mm |
Temperature sensor |
1 piece |
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Net weight |
70kG |
Color |
White+Grey |
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Newest BGA/LED repairing machine ZM-R720A for small component chip soldering and desoldering was added in Jun 2018
Newest BGA/LED repairing machine ZM-R720A for small component chip soldering and desoldering has been viewed 494 times
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