Top selling BGA chip rework station Seamark ZM-R6200 for laptop/mobile PCBA BGA chip IC soldering and desoldering
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Top selling BGA chip rework station Seamark ZM-R6200 for laptop/mobile PCBA BGA chip IC soldering and desoldering |
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Top selling BGA chip rework station Seamark ZM-R6200 for laptop/mobile PCBA BGA chip IC soldering and desoldering Description:
We provide SMT inspection and repairing equipment, you are welcome to contact Rita Li by:
whatsapp:0086 134 3448 1030
SKype:ritaleeli
Email:sales11@zhuomao.com.cn
Application
This machine is used for repairing the broken BGA (Ball Grid Array package) chipset on the PCB motherboard.
BGA application
1. Laptop & desktop PCBA
2.Game console,such as Xbox one,Play Station 4
3.Mobile phone PCBA
4.TV&TV Set-top box motherboard
5.Server ,Printer,Camera etc motherboard
Main Features
Scientific & Smart
1, There are 3 independent heating areas, hot-air heaters+ IR preheating area which can heat stably and fast while prevent PCBA from deformation
2. Top heater air volume , bottom heater height and IR preheating area could be adjusted to apply to different kinds of BGA repairing.
3, Equipped with different sizes of titanium alloy BGA nozzles, can be rotated 360 degree, easy to place and change.
4, Can set 6 segments of rising temperature and 6 segments of constant temperature,can memory N groups of temp profiles, which can be used at any time.
Precise
1, Adopt high-precision K-sensor closed-loop temp control as well as PID profiles automatic adjusting system.temp precision is approximately within 3 degree
2. X-axis, Y-axis and chip angle adjustment device to find precise position
3. Built-in laser positioning device for PCB fast and precise positioning.
4, 15 inch HD LCD and optical alignment system,maximum 230 times magnification of the components,mounting precision is within 0.01mm
Safe:
1. Strict quality control system and all machines are CE approved
2. Different operation interface to prevent exited settings from being modified.
3. Emergency button and alarm for abnormal situations, it can protect PCB boards,components and machine itself.
Specification of ZM-R6200
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1 |
Total power |
Max 5800W |
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2 |
Power Supply |
AC220V 50/60Hz |
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Heater Power |
Top heater 1200W+Bottome heater 1200+IR heater 2700W |
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4 |
Max heating temperature |
400°C |
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5 |
Position |
V-groove + universal fixture ,can move easily |
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Available PCB size |
Max 410×370mm; Min 65×65mm |
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Available chip |
2×2~ 80×80mm |
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Available chip type |
BGA/QGN/CSP/QFN |
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9 |
Temp control |
K-sensor closed-loop |
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10 |
Sensor |
1 PCS |
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11 |
Dimension |
L640×W630×H900mm |
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12 |
Net weight |
68kg |
Top selling BGA chip rework station Seamark ZM-R6200 for laptop/mobile PCBA BGA chip IC soldering and desoldering was added in Nov 2018
Top selling BGA chip rework station Seamark ZM-R6200 for laptop/mobile PCBA BGA chip IC soldering and desoldering has been viewed 294 times
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