shenzhen factory low price electronics main board and electronic control board

SERIAL

ITEM

TECHNICAL DATA

1

Types of Products

HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB，FPC, Teflon Board, and HDI

2

Layers

2－26(layers)

3

Max Board Size

450x660mm 18" x 26"

4

Min Board Thickness

4（layers）0.40mm 16mil

6（layers）0.80mm 32mil

8（layers）1.00mm 40mil

10（layers）1.20mm 48mil

5

Copper Clad(Max.)

6 oz(outer)/4 oz(inner)

6

Min line Width/space

0.075mm    3mil

7

Drill Size Mechanical (min)

0.20mm 8mil

8

Drill Size Laser(min)

0.10mm 4mil

9

PTH Wall Thickness

0.020mm 0.8mil

10

PTH dia tolerance

±0.075mm ±3mil

11

NPTH hole dia tolerance

±0.05mm ±2mil

12

Hole Position Deviation

±0.05mm ±2mil

13

Outline Tolerance

±0.10mm ±4mil

14

S/M Pitch

0.08mm 3mil

15

Insulation Resistance

1E+12Ω(Normal)

16

Test Voltage

50~300V

17

Aspect ratio

8：1

18

Thermal Shock

3x10Sec@288 ℃

19

Warp and Twist

≤0.7%

20

Current breakdown

10A

21

Electric Strength

＞1.3KV/mm

18

Peel Strength

1.4N/mm

23

Solder Mask Abrasion

≥6H

24

Flammability

94V-0

25

Impedance Control

+/-10%(Differential)

26

Buried Via

Yes

27

Blind Via

Yes

28

HDI

2+N+2 4mil Via hole

29

Surface Finished

ENIG,ImAg,ImSn,OSP,HASL

30

Materials

FR-4 1, F4B ,CEM-1,CEM-3 Getek,Rogers,Aluminum Board,      High TG