Auburn University
Auburn University is a public land-grant research university in Auburn, Alabama. With more than 24,600 undergraduate students and a total enrollment of more than 30,000 with 1,330 faculty members, Auburn is the second largest ...
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1 technical article »
Effect Of Vacuum Reflow On Solder Joint Voiding In Bumped Components
Apr 21, 2021 | Arvind Srinivasan Karthikeyan, Sa'd Hamasha, Michael Meilunas, Fred Dimock
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness. Due to the various advantages they offer, the use of Ball Grid Array packages is common across all industry sectors. They are also prone to process voiding issues. This study was performed to determine if vacuum assisted reflow process can help alleviate the voids in area array solder joints. Test parameters in this study largely focused on vacuum pressure level and vacuum dwell time....
