Pillarhouse Jade MKII

Pillarhouse Jade MKII Description:

To see more about the Jade MKII Single Point Selective Soldering System visit Pillarhouse USA at: https://www.pillarhouse.co.uk/products/selective-soldering-handload/jade-mkii-handload

Entry-level, single point selective soldering system

Designed to meet the needs of the small/medium batch manufacturer who requires high levels of production flexibility, the Jade MKll entry-level system offers uncompromised selective soldering quality at a very low cost.

The Jade MKII is a handload system, incorporating a universally adjustable tooling carrier capable of accommodating PCBs or pallets up to 457 x 508mm.

Our patented Drop-Jet design fluxer offers quick and effective flushing of the pressurised flux chamber. This helps to keep maintenance levels to a minimum whilst enabling use of higher solid content fluxes as well as water-soluble fluxes.

Description

As part of the entry-level philosophy for this system, a low maintenance solder bath and pump mechanism has been developed which moves in three axes of movement whilst not limiting access to the PCB. Solder is applied using proven technology through our AP nozzle design or custom specialised nozzles, incorporating patented spiral solder return to bath technology offering reduced solder balling potential.

As with all Pillarhouse systems, the soldering process is enhanced by a hot Nitrogen curtain which provides an inert atmosphere. This method of soldering also assists in the prevention of oxidisation and provides a local pre-heat to the joint, thus reducing thermal shock to localised components.

The Jade MKII is controlled by a PC through our next generation PillarCOMMX software, a Windows® based ‘Point & Click’ interface with PCB image display. Additionally, our PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.

Standard Features

• Integral PC and machine mounted TFT monitor
• Inerted Nitrogen system
• Titanium Drop-Jet fluxer
• Set of AP style solder nozzle tips
• Universally adjustable tooling carrier
• Internal fume extraction
• Colour programming camera
• Process viewing camera
• Solder wave height measurement and correction
• Auto solder top-up (wire feed) & solder level detect
• Thermal nozzle calibration system using integrated setting camera (requires manual correction)
• PillarCOMM Windows® based ‘Point & Click’ interface
• PillarPAD offline programming package
• Multiple level password protection
• Manual fiducial correction
• Lead-free compatible
• Day-to-day service kit

Monitoring Options

• Flux presence sensor – thermistor style
• Flux spray, flow and spray & flow
• Pump rpm
• O2 ppm
• Nitrogen flow

System Options

• Top-side instant IR preheat
• Closed loop temperature control – via pyrometer or thermocouple
• Bottom-side IR ring heater
• Bottom-side hot Nitrogen selective preheat
• Automatic fiducial correction
• Ultrasonic fluxing
• Dual Drop-Jet / ultrasonic fluxing
• Laser PCB warp correction
• Micro nozzle assembly
• Solder reel identification
• Rapid change solder bath and pump system capability – does not include solder bath and pump
• Solder bath coding – identifies correct bath for program – only suitable for use with rapid change solder bath and pump system
• Encoders on X, Y and Z axis
• Larger PCB handling size
• Nitrogen generator