Technical Articles From Tessera Technologies

Read technical articles about electronics manufacturing added by Tessera Technologies

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Articles from Tessera Technologies

1 technical article added by Tessera Technologies

Company Information:

Tessera is focused on miniaturization technologies and has licensed its chip packaging technology to numerous semiconductor manufacturers, including Intel and Samsung Electronics.

San Jose, California, USA

Manufacturer

408-894-0700
408-894-0768

See Company Website »

Company Postings:

(1) technical library article

(1) news release

Assembly Process Development for Chip-Scale and Chip-Size μBGA™

May 09, 1999 | Vern Solberg.

This paper will review chip-scale and chip-size package variations, solder alloy options, furnish guidelines for solder stencil development and outline the actual processes used to successfully produce SMT assemblies utilizing CSP technology. ...