Technical Articles From ASM Assembly Systems (DEK)
Read technical articles about electronics manufacturing added by ASM Assembly Systems (DEK)
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5 technical articles added by ASM Assembly Systems (DEK)
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Investigating the Metric 0201 Assembly Process
Dec 24, 2020 | Clive Ashmore
The advance in technology and its relentless development is delivering yet another surface mount assembly challenge. To meet the market demand for products with higher functionality whilst reducing the overall product size, the next generation of chip package is being readied upon the surface mount community. The Metric 0201 will have dimensions in the order of 0.25mm x 0.125mm, as a result the entire assembly process will be questioned as to its ability to deliver high volume/quality product....
Screen and Stencil Printing Processes for Wafer Backside Coating
Sep 09, 2009 | Mark Whitmore, Jeff Schake.
Stencil printing equipment has traditionally been used in the surface mount assembly industry for solder paste printing. In recent years the flexibility of the tool has been exploited for a wide range of materials and processes to aid semiconductor packaging and assembly. One such application has been the deposition of adhesive coatings onto the backside of silicon wafers....
Fuel Cell Production Revs Up. The Paste Printing Platform And Process Has Other Uses, Too.
Dec 18, 2008 | Clive Ashmore, Global Applied Process Engineering Manager; DEK.
Unless you've been living under a rock the past several years, you are no doubt keenly aware of the global drive toward alternative energy sources. Certainly this initiative is attractive because of the clear environmental benefits of developing fossil fuel substitutes, but also because of potential economic benefit. Although fuel cell technology has been proven viable for various applications, the production costs still remain relatively high, and further process development to promote low-cost, high-volume manufacturing is required to reach a price point that encourages widespread consumer acceptance....
Lean, Mean Dual-Lane Machines
Dec 27, 2007 | DEK
The latest screen printing platforms unlock more of the potential from dual-lane processing. Simultaneous demands to enhance flexibility while increasing utilisation and overall throughput apply to manufacturers operating at virtually any point in the mix-volume continuum: capacity must work hard to deliver the required return. As these lean manufacturing principles hold sway from the US and Europe to the Far East, no modern assembler has a second to spare....
A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing
Dec 13, 2007 | Steve Watkin, Semicon Packaging Technologies Division, and Tom Falcon, Future Technologies Group, DEK
Printer-hosted processes for solder ball placement are now widely used for package technologies ranging from BGAs using ball diameters above 750μm to the latest WL-CSPs demanding 250μm diameter. This broadening spectrum of applications brings more choices in terms of stencil design rules and production methodologies....
