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Technical Articles From The Foundation for Scientific and Industrial Research - SINTEF
Read technical articles about electronics manufacturing added by The Foundation for Scientific and Industrial Research - SINTEF
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1 technical article added by The Foundation for Scientific and Industrial Research - SINTEF
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Wafer-Level Packaged MEMS Switch With TSV
Feb 02, 2012 | Nicolas Lietaer, Thor Bakke, Anand Summanwar (SINTEF), Per Dalsjø, Jakob Gakkestad (Norwegian Defence Research Establishment), Frank Niklaus (KTH – Royal Institute of Technology)
A miniaturized wafer-level packaged MEMS acceleration switch with through silicon vias (TSVs) was fabricated, based on technologies suitable for harsh environment applications. The high aspect ratio TSVs were fabricated through the silicon-on-insulator (S...