![Electronics Manufacturing Training](/images/icons/technical-library-icon.jpg)
Technical Articles From Robert Bosch LLC Automotive Electronics Division
Read technical articles about electronics manufacturing added by Robert Bosch LLC Automotive Electronics Division
- SMTnet
- »
- Technical Library
- »
- Contributors
- »
- Articles from Robert Bosch LLC Automotive Electronics Division
3 technical articles added by Robert Bosch LLC Automotive Electronics Division
Company Information:
Process Control of Ionic Contamination Achieving 6-Sigma Criteria in The Assembly of Electronic Circuits
Nov 29, 2018 | P. Eckold, M. Routley, L. Henneken, G. Naisbitt, R. Fritsch, U. Welzel
Ionic contamination testing as a process control tool a newly developed testing protocol based on IPC-TM 650 2.3.25, was established to enable monitoring of ionic contamination within series production. The testing procedure was successfully implemented within the production of high reliability, safety critical electronic circuits, involving multiple production sites around the world. I will be shown in this paper that the test protocol is capable for meeting Six-Sigma-Criteria....
Wettable-Flanks: Enabler for the Use of Bottom-Termination Components in Mass Production of High-Reliability Electronic Control Units
May 23, 2018 | Udo Welzel, Marco Braun, Stefan Scheller, Sven Issing, Harald Feufel
Driven by miniaturization, cost reduction and tighter requirements for electrical and thermal performance, the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-leads (SON), quad-flat no leads (QFN) packages etc., is increasing. However, a major distractor for the use of such packages in high-reliability applications has been the lack of a visible solder (toe) fillet on the edge surface of the pins: because the post-package assembly singulation process typically leaves bare copper leadframe at the singulation edge, which is not protected against oxidation and thus does not easily solder-wet, a solder fillet (toe fillet) does not generally develop....
How to Profile a PCB.
Sep 10, 2010 | M. N. Srinivasa Prasad.
An optimal reflow profile is one of the most critical factors in achieving quality solder joints on a printed circuit board (PCB) assembly with surface mount components. A profile is a function of temperatures applied to the assembly over time. When graphed on a Cartesian plane, a curve is formed that represents the temperature at a specific point on the PCB, at any given time, throughout the reflow process....